PROCESS OF TREATING DEFECTS DURING THE BONDING OF WAFERS
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Accused Products
Abstract
The invention concerns a process of preparing a thin layer to be transferred onto a substrate having a surface topology and, therefore, variations in altitude or level, in a direction perpendicular to a plane defined by the thin layer, this process comprising the formation on the thin layer of a layer of adhesive material, the thickness of which enables carrying out a plurality of polishing steps of its surface in order to eliminate any defect or void or almost any defect or void, in preparation for an assembly via a molecular kind of bonding with the substrate.
7 Citations
48 Claims
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1-20. -20. (canceled)
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21. A method of preparing a thin layer in preparation for a transfer onto a substrate the thin layer comprising a surface topology including variations in altitude in a direction perpendicular to a plane defined by the thin layer, the process comprising:
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forming a layer of adhesion material on the thin layer, the layer of adhesion material on the thin layer having a thickness having an initial value enabling performance of at least one step of leveling of the surface of the adhesion material on the thin layer; leveling the surface of the adhesion material on the thin layer; assembling the layer of adhesion material on the thin layer with the substrate; detecting defects at a bonding interface between the layer of adhesion material and the substrate; separating the substrate and the thin layer at the bonding interface; and again leveling the surface of the adhesion material on the thin layer. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 48)
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35. A method of preparing a thin layer and a substrate in preparation for transferring the thin layer onto the substrate, the thin layer having a surface topology including variations in altitude in a direction perpendicular to a plane defined by the thin layer, the process comprising:
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providing a layer of adhesion material on the thin layer and another layer of adhesion material on the substrate, the layer of adhesion material on the thin layer and the another layer of adhesion material on the substrate each having a respective thickness having an initial value enabling performance of at least one step of leveling of at least one of a surface of the layer of adhesion material on the thin layer and a surface of the another layer of adhesion material on the substrate; leveling at least one of the surface of the layer of adhesion material on the thin layer and the surface of the another layer of adhesion material on the substrate; assembling the layer of adhesion material on the thin layer and the another layer of adhesion material on the substrate; detecting defects at a bonding interface between the layer of adhesion material on the thin layer and the another layer of adhesion material; separating the another layer of adhesion material on the substrate and the layer of adhesion material on the thin layer at the bonding interface; and again leveling at least one of the surface of the layer of adhesion material on the thin layer and the surface of the another layer of adhesion material on the substrate. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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48-1. The method of claim 34, further comprising at least one of polishing and cleaning the at least one of the surface of the layer of adhesion material on the thin layer and the surface of the another layer of adhesion material on the substrate after leveling the at least one of the surface of the layer of adhesion material on the thin layer and the surface of the another layer of adhesion material on the substrate and prior to assembling the layer of adhesion material on the thin layer and the another layer of adhesion material on the substrate.
Specification