METHOD FOR FABRICATION OF TRANSPARENT GAS BARRIER FILM USING PLASMA SURFACE TREATMENT AND TRANSPARENT GAS BARRIER FILM FABRICATED THEREBY

• US 20100285319A1
• Filed: 01/07/2009
• Published: 11/11/2010
• Est. Priority Date: 01/07/2008
• Status: Abandoned Application

• Current Assignee: Korea Advanced Institute of Science and Technology
• Original Assignee: Korea Advanced Institute of Science and Technology
• Inventors: Kwak, Soonjong, Jun, Jae Ho
• Application Number:
  US12/811,762
• Publication Number:
  US 20100285319A1
• Time in Patent Office: Days
• US Class Current: 428/411.1
• CPC Class Codes: B05D 2252/10 Applying the material on both sides
• CPC Class Codes: B05D 3/145 After-treatment
• CPC Class Codes: B05D 7/04 to surfaces of films or sheets producing layered products by applying coatings of pasty or pulverulent plastics B29C41/00
• CPC Class Codes: C08J 7/123 Treatment by wave energy or particle radiation C08J7/18 takes precedence
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]

Abstract

The present invention relates to a method of fabricating a transparent gas barrier film by using plasma surface treatment and a transparent gas barrier film fabricated according to such method which has an organic/inorganic gradient interface structure at the interface between an organic/inorganic hybrid layer and an inorganic layer. Since the method of the present invention is capable of fabricating a gas barrier film by plasma surface treatment instead of deposition under high vacuum, it can mass-produce a transparent gas barrier film with excellent gas barrier properties in an economical and simple manner. Further, since the transparent gas barrier film fabricated according to the method of the present invention shows excellent gas barrier properties and is free of crack formation and layer-peeling phenomenon, it can be effectively used in the manufacture of a variety of display panels.

Claims

1. A method of fabricating a transparent gas barrier film with excellent gas barrier properties comprising:

a) coating an organic/inorganic hybrid solution on the surface of a transparent plastic film to form an organic/inorganic hybrid layer; and

b) treating the surface of the organic/inorganic hybrid layer formed on the transparent plastic film with plasma of reactive gas to form an inorganic layer having an organic/inorganic gradient interface structure.

2. The method according to claim 1, wherein the transparent plastic film in step a) is selected from the group consisting of ployethersulfone (PES), polycarbonate (PC), polyimide (PI), polyarylate (PAR), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cycloolefin copolymer, epoxy resin, and unsaturated polyester.

3. The method according to claim 1, wherein the organic/inorganic hybrid solution in step a) is prepared by sol-gel type hydrolysis.

4. The method according to claim 1, wherein the organic/inorganic hybrid solution in step a) is prepared by using a compound selected from the group consisting of:

alkoxysilane represented by Formula 1;

R_x¹Si(OR²)_(4-x) 

 

<

Formula 1>

wherein R¹ is C₁-C₂₀ alkyl, C₆-C₂₀ aryl, vinyl, acryl, methacryl or epoxy;

R² is C₁-C₂₀ alkyl or C₆-C₂₀ aryl;

x is an integer ranging from 1 to 3; and

when R¹ and R² are alkyl, said alkyl can be replaced with fluorine instead of hydrogen;

silanealkoxide represented by Formula 2;

Si(OR³)₄ 

 

<

Formula 2>

wherein R³ is C₁-C₂₀ alkyl or C₆-C₂₀ aryl; and

when R³ is alkyl, said alkyl can be replaced with fluorine instead of hydrogen;

and any mixtures thereof.

5. The method according to claim 4, wherein the alkoxysilane compound includes trialkoxysilane (R¹Si(OR²)₃) and dialkoxysilane (R¹₂Si(OR²)₂).

6. The method according to claim 5, wherein the trialkoxysilane (R¹Si(OR²)₃) compound is selected from the group consisting of methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, vinyltriethoxysilane, and vinyltrimethoxysilane.

7. The method according to claim 5, wherein the dialkoxysilane (R¹₂Si(OR²)₂) compound is selected from the group consisting of dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, and diethyldiethoxysilane.

8. The method according to claim 4, wherein the silanealkoxide (Si(OR³)₄) compound is selected from the group consisting of tetraethylorthosilicate, tetramethylorthosilicate, tetraisopropoxysilicate, and tetrabutoxysilicate.

9. The method according to claim 4, wherein when a mixture of the alkoxysilane and silanealkoxide is used in step a), the alkoxysilane and silanealkoxide compounds are mixed in a molar ratio of 1:

5 to 10;

1.

10. The method according to claim 1, wherein the organic/inorganic hybrid layer in step a) is formed by heat curing or photocuring the organic/inorganic hybrid solution coated on the surface of the transparent plastic film.

11. The method according to claim 1, wherein the organic/inorganic hybrid layer formed in step a) has a thickness ranging from 0.5 to 5 μ

m.

12. The method according to claim 1, wherein the reactive gas in step b) is selected from the group consisting of oxygen (O₂), nitrous oxide (N₂O), nitrogen (N₂), ammonia (NH₃), hydrogen (H₂), H₂O, mixtures thereof, and mixtures in combination with inert gas.

13. The method according to claim 1, wherein the inorganic layer in step b) is formed by converting a part of the organic/inorganic hybrid layer into an inorganic layer while removing hydrocarbons from the surface thereof by plasma surface treatment.

14. The method according to claim 1, wherein the inorganic layer formed in step b) has a thickness ranging from 10 to 500 mm.

15. The method according to claim 1, wherein the interface between the inorganic layer and the organic/inorganic hybrid layer is not clearly delineated due to the presence of an organic/inorganic gradient interface structure.

16. The method according to claim 1, wherein steps a) and b) are carried out once on one side of the transparent plastic film, carried out repeatedly on one side of the transparent plastic film, carried out once on both sides of the transparent plastic film, or carried out repeatedly on both sides of the transparent plastic film.

17. The method according to claim 16, wherein when carrying out steps a) and b) on both sides of the transparent plastic film, steps a) and b) are carried out first on one side of the transparent plastic film, followed by carrying out steps a) and b) on the other side of the transparent plastic film, or step a) is carried out first on both sides of the transparent plastic film, followed by carrying out step b) thereon.

18. A transparent gas barrier film fabricated according to the method of claim 1, comprising a transparent plastic film, an organic/inorganic hybrid layer and an inorganic layer, wherein the interface between the organic/inorganic hybrid layer and the inorganic layer has an organic/inorganic gradient interface structure showing a gradual change in composition from inorganic materials to organic/inorganic materials.

19. The transparent gas barrier film according to claim 18, wherein the inorganic layer is formed by converting a part of the organic/inorganic hybrid layer into an inorganic layer while removing hydrocarbons from the surface thereof by plasma surface treatment.

20. The transparent gas barrier film according to claim 18, wherein the interface between the inorganic layer and the organic/inorganic hybrid layer is not clearly delineated due to the presence of an organic/inorganic gradient interface structure.