Die Down Ball Grid Array Packages and Method for Making Same

• US 20100285637A1
• Filed: 07/23/2010
• Published: 11/11/2010
• Est. Priority Date: 09/29/2004
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Zhao, Sam Ziqun, Khan, Reza-Ur Rahman
• Granted Patent: US 8,021,927 B2
• Time in Patent Office: Days
• US Class Current: 438/122
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49171 : Fan-out arrangements
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73207 : Bump and wire connectors
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/13 : characterised by the shape
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3677 : Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49833 : the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/50 : for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/91 : Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.

Claims

1. A method of forming a ball grid array (BGA) package, comprising:

(a) coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening; and

(b) coupling a first surface of a second substrate to the IC die via a bump interconnect;

wherein the second surface of the second substrate has an array of contact pads capable of coupling to a board.

2. The method of claim 1, wherein step (a) comprises:

forming a cavity in the heat spreader in which the IC die is attached, wherein the cavity has an opening that is smaller than the opening in the first substrate.

3. The method of claim 1, wherein step (a) comprises using a metal plate or a conductive material as the heat spreader.

4. The method of claim 1, wherein step (a) comprises attaching the IC die to the heat spreader using an adhesive material or an epoxy.

5. The method of claim 1, wherein step (a) comprises using one of a tape substrate, an organic substrate, a ceramic substrate, a glass substrate, or a polyimide tape substrate as the first substrate.

6. The method of claim 1, wherein step (a) comprises using a multi-layer substrate as the first substrate.

7. The method of claim 1, further comprising:

(c) mounting the first and second substrates to a printed wire board (PWB).

8. The method of claim 7, wherein step (c) comprises:

using an array of solder balls to perform the mounting of the first and second substrates to the PWB.

9. The method of claim 7, wherein step (c) comprises:

using an array of solder balls to perform the mounting of the first substrate to the PWB; and

using solder paste to perform the mounting of the second substrate to the PWB.

10. The method of claim 1, wherein step (b) comprises:

using a printed circuit on one of a stiff or flexible dielectric substrate as the second substrate.

11. The method of claim 10, further comprising:

using one of bismaleimide tiiazine (BT) resin substrate, resin substrate, polyimide tape substrate, tape substrate, flame retardant type 4 (FR4) laminate substrate, ceramic substrate, or glass substrate as the dielectric substrate.

12. The method of claim 1, wherein step (b) comprises:

using a multi-layer substrate as the second substrate.

13. The method of claim 1, wherein step (b) comprises:

using an adhesive material to couple the first surface of the second substrate to the IC die.

14. The method of claim 1, further comprising:

performing underfilling to secure the bump interconnect between the IC die and the second substrate.

15. The method of claim 14, further comprising:

covering at least partially the heat spreader, the first and second substrates, and the IC die with an encapsulating material.

16. The method of claim 1, wherein in step (b) attaching the second substrate to the central portion of the IC die allows power to be delivered to and from the central portion of the IC die via the second substrate.

17. The method of claim 1, wherein in step (b) attaching the second substrate to the IC die allows for power to be transmitted between devices in the central portion of the IC die via the second substrate.

18. The method of claim 1, wherein in step (b) the second substrate is attached to the IC die, on which a peripheral area of the IC die includes only input/output (I/O) devices.

19. The method of claim 1, further comprising:

(c) using a wire bond arrangement to attach at least one of the IC die, the first substrate, the second substrate, and the heat spreader to at least another one of the IC die, the first substrate, the second substrate, and the heat spreader.

20. The method of claim 19, wherein step (c) comprises:

using a wire bond to attach the IC die to the heat spreader; and

using at least one wire bond to attach the IC die to the first substrate.

21. The method of claim 19, wherein step (c) comprises:

using a wire bond to attach the IC die to the heat spreader;

using at least one wire bond to attach the IC die to the first substrate; and

using a wire bond to attach the IC die to the second substrate.

22. The method of claim 19, wherein step (c) comprises:

using a wire bond to attach the second substrate to the heat spreader;

using at least one wire bond to attach the second substrate to the first substrate.

23. The method of claim 1, wherein step (b) comprises:

using a metal substrate as the second substrate.

24. The method of claim 23, wherein step (b) further comprises:

forming a central opening in the metal substrate.

25. The method of claim 23, wherein step (b) comprises:

using a copper plate as the metal substrate.

26. The method of claim 23, wherein step (b) comprises:

forming a central portion of the metal substrate with a larger thickness than a peripheral portion.

27. The method of claim 23, wherein step (b) comprises:

forming a step along a peripheral portion of the metal substrate;

using a wire bond to attach the IC die to the first substrate;

using a wire bond to attach the IC die to the step of the metal substrate;

using a wire bond to attach the IC die to the first substrate; and

using a wire bond to attach the step of the metal substrate to the heat spreader.

28. The method of claim 23, wherein step (b) comprises:

forming a step along a peripheral portion of the metal substrate;

using a wire bond to attach the IC die to the heat spreader;

using a wire bond to attach the IC die to the first substrate; and

using a wire bond to attach the IC die to the step of the second substrate.

29. The method of claim 23, wherein step (b) comprises:

forming a central opening in the metal substrate;

forming a first step along a peripheral portion of the metal substrate;

forming a second step along a second step proximate the central opening of the metal substrate;

using a wire bond to attach the IC die to the heat spreader;

using a wire bond to attach the IC die to the first substrate;

using a wire bond to attach the IC die to the second step of the metal substrate;

using a wire bond to attach the IC die to the first step on a first side of the central opening of the metal substrate; and

using a wire bond to attach the IC die to the first step on a second side of the central opening of the metal substrate.