METHODS OF FABRICATING INTEGRATED CIRCUIT DEVICES INCLUDING AIR SPACERS SEPARATING CONDUCTIVE STRUCTURES AND CONTACT PLUGS
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Abstract
An integrated circuit device includes first and second conductive structures spaced apart from one another on a substrate along a first direction. The first and second conductive structures extend in a second direction substantially perpendicular to the first direction. A contact plug is interposed between the first and second conductive structures and is separated therefrom along the first direction by respective air gaps on opposite sides of the contact plug. The air gaps define first and second air spacers that electrically insulate the contact plug from the first and second conductive structures, respectively. An upper insulation layer covers the first and second air spacers and the first and second conductive structures. The air spacers may sufficiently reduce the loading capacitance between the conductive structures. Related fabrication methods are also discussed.
57 Citations
38 Claims
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1-10. -10. (canceled)
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11. A method of fabricating an integrated circuit device, the method comprising:
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forming first and second conductive structures on a substrate spaced apart from one another in a first direction and extending in a second direction substantially perpendicular to the first direction; forming a contact plug between the first and second conductive structures and spaced apart from the first and second conductive structures in the first direction by respective air gaps on opposite sides of the contact plug, the air gaps defining first and second air spacers that electrically insulate the contact plug from the first and second conductive structures, respectively; and forming an upper insulation layer on the first and second air spacers and the first and second conductive structures. - View Dependent Claims (12, 13, 14)
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15-29. -29. (canceled)
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30. A method of fabricating an integrated circuit device, the method comprising:
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forming a structure on a substrate, the structure including at least one pad contact; forming a plurality of bit line structures on the substrate spaced apart from one another along a first direction, the bit line structures extending in a second direction substantially perpendicular to the first direction; forming respective contact plugs between neighboring ones of the bit line structures and spaced apart therefrom by first gaps in the first direction, the first gaps defining respective air spacers that electrically insulate the neighboring ones of the bit line structures from the respective contact plugs therebetween; and forming an upper insulation layer covering the air spacers and the bit line structures. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38)
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Specification