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Printable Semiconductor Structures and Related Methods of Making and Assembling

  • US 20100289124A1
  • Filed: 07/27/2010
  • Published: 11/18/2010
  • Est. Priority Date: 06/04/2004
  • Status: Active Grant
First Claim
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1. A printable semiconductor structure comprising:

  • a printable semiconductor element; and

    a first bridge element connected to said printable semiconductor structure and connected to a mother wafer, wherein said printable semiconductor element and said first bridge element are at least partially undercut from said mother wafer;

    wherein contacting said printable semiconductor with a transfer device is capable of fracturing said first bridge element, thereby releasing said printable semiconductor structure from said mother wafer.

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