PROBE FOR A SOCKET, SOCKET FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND ELECTRONIC DEVICE

• US 20100289515A1
• Filed: 05/10/2010
• Published: 11/18/2010
• Est. Priority Date: 05/15/2009
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: KIRIKI, Nobuaki
• Granted Patent: US 8,471,576 B2
• Time in Patent Office: Days
• US Class Current: 324/750.05
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: G01R 1/06722 Spring-loaded
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A socket for electrically connecting conductive patterns of a circuit board and electrodes of an integrated circuit, the socket includes a main body, a plurality of hollow probes that connect conductive patterns of the circuit board and electrodes of the integrated circuit, the plurality of hollow probes provided to the main body, and an outlet that discharges a refrigerating medium passing through each of the hollow probes, the outlet provided on a side of the main body.

Claims

1. A socket for electrically connecting conductive patterns of a circuit board and electrodes of an integrated circuit, the socket comprising:

a main body;

a plurality of hollow probes that connect conductive patterns of the circuit board and electrodes of the integrated circuit, the plurality of hollow probes provided to the main body; and

an outlet that discharges a refrigerating medium passing through each of the hollow probes, the outlet provided on a side of the main body.

2. The socket according to claim 1, wherein each of the hollow probes comprises an upper portion that is in contact with the integrated circuit with a portion shaped into peaks and notches.

3. The socket according to claim 1, wherein the main body comprises a side block that supports the integrated circuit so as to form a space between a surface of the main body and the integrated circuit, and the side block is provided with the outlet.

4. The socket according to claim 1, wherein each of the hollow probes comprises an upper portion including a peak portion that is in contact with an electrode of the integrated circuit and a notch portion that discharges the refrigerating medium from inside of the main body into air, and a lower portion including a plane surface that is in contact with the conductive pattern provided around a corresponding through hole of the circuit board.

5. The socket according to claim 1, wherein each of the hollow probes comprises an upper hollow portion including a peak portion which is in contact with an electrode of the integrated circuit and a notch portion that discharges the refrigerating medium from inside of the main body into air, and a lower hollow portion that is in contact with the conductive pattern provided around a corresponding through hole of the circuit board.

6. The socket according to claim 5, wherein each of the hollow probes comprises a conductive elastic member provided between the upper hollow portion and the lower hollow portion, and a middle hollow portion covered the conductive elastic member.

7. An electronic device comprising:

an integrated circuit that includes electrodes;

a circuit board that includes conductive patterns and a plurality of through holes, each of the conductive patterns provided around the corresponding through holes;

a fan that sends a refrigerating medium; and

a socket that electrically connects the conductive patterns of the circuit board and the electrodes of the integrated circuit, wherein the socket includes

a main body,

a plurality of hollow probes that connect the conductive patterns of the circuit board and the electrodes of the integrated circuit, the plurality of hollow probes provided to the main body, and

an outlet that discharges a refrigerating medium passing through each of the hollow probes from the corresponding through holes, the outlet provided on a side of the main body.

8. The electronic device according to claim 7, wherein each of the hollow probes comprises an upper portion that is in contact with the integrated circuit with a portion shaped into peaks and notches.

9. The electronic device according to claim 7, wherein the main body comprises a side block that supports the integrated circuit so as to form a space between a surface of the main body and the integrated circuit, and the side block is provided with the outlet.

10. The electronic device according to claim 7, wherein each of the hollow probes comprises an upper portion including a peak portion that is in contact with an electrode of the integrated circuit and a notch portion that discharges the refrigerating medium into air, and a lower portion including a plane surface that is in contact with the conductive pattern.

11. The electronic device according to claim 7, wherein each of the hollow probes comprises an upper hollow portion including a peak portion that is in contact with an electrode of the integrated circuit and a notch portion that discharges the refrigerating medium into air, and a lower hollow portion that is in contact with the conductive pattern.

12. The electronic device according to claim 11, wherein each of the hollow probes comprise a conductive elastic member provided between the upper hollow portion and the lower hollow portion, and a middle hollow portion covered the conductive elastic member.

13. The electronic device according to claim 7, further comprising a cooling mechanism that cools the integrated circuit.

14. The electronic device according to claim 13, wherein the cooling mechanism is a heat sink provided above the integrated circuit, and includes a second fan that cools the heat sink.

15. A probe for a socket electrically connecting a circuit board and an integrated circuit, the probe comprising:

a main body that connects conductive patterns of the circuit board and electrodes of the integrated circuit, the main body being hollow and includes a portion shaped into peaks and notches in an upper portion being in contact with the integrated circuit.

16. The probe according to claim 15, wherein the main body comprises an upper portion including a peak portion that is in contact with an electrode of the integrated circuit and a notch portion that discharges the refrigerating medium from inside of the main body into air, and

a lower portion including a plane surface that is in contact with the conductive pattern provided around a corresponding through hole of the circuit board.

17. The probe according to claim 15, wherein the main body comprises an upper hollow portion including a peak portion that is in contact with an electrode of the integrated circuit and a notch portion that discharges the refrigerating medium from inside of the main body into air, and a lower hollow portion that is in contact with the conductive pattern provided around a corresponding through hole of a circuit board.

18. The probe according to claim 17, the main body comprises a conductive elastic member provided between the upper hollow portion and the lower hollow portion, and a middle hollow portion covered the conductive elastic member.