SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device comprising:
- a semiconductor substrate including at least one of a circuit and a circuit element; and
an inductor element having a coil axis extending in a direction parallel to a main surface of the semiconductor substrate and disposed adjacent to the main surface,whereina main direction of a magnetic field induced by passing a current through the inductor element is parallel to the main surface.
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Abstract
A semiconductor device includes a semiconductor substrate including at least one of a circuit and a circuit element, and an inductor element having a coil axis extending in a direction parallel to a main surface of the semiconductor substrate and disposed adjacent to the main surface. A main direction of a magnetic field induced by passing a current through the inductor element is parallel to the main surface.
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Citations
18 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate including at least one of a circuit and a circuit element; and an inductor element having a coil axis extending in a direction parallel to a main surface of the semiconductor substrate and disposed adjacent to the main surface, wherein a main direction of a magnetic field induced by passing a current through the inductor element is parallel to the main surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
wherein the inductor element is supported by the substrate or the block.
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3. The semiconductor device of claim 1, further comprising:
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conductor pads formed in the main surface of the semiconductor substrate, wherein the inductor element includes a pair of connection terminals electrically connected to the semiconductor substrate via the conductor pads.
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4. The semiconductor device of claim 3, wherein
the connection terminals and the conductor pads are connected via gold bumps. -
5. The semiconductor device of claim 1, wherein
the inductor element includes a winding having one or more turns. -
6. The semiconductor device of claim 3, wherein
the pair of connection terminals of the inductor element are oriented in the same direction. -
7. The semiconductor device of claim 1, wherein
there are a plurality of the inductor elements. -
8. The semiconductor device of claim 7, wherein
no two of the inductor elements are inductively coupled with each other. -
9. The semiconductor device of claim 7, wherein
at least two of the inductor elements are inductively coupled with each other.
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10. A semiconductor device comprising:
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a semiconductor substrate including at least one of a circuit and a circuit element; and an inductor element disposed adjacent to a main surface of the semiconductor substrate and disposed in a plane perpendicular to the main surface, wherein a main direction of a magnetic field induced by passing a current through the inductor element is parallel to the main surface. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
wherein the inductor element is supported by the substrate or the block.
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12. The semiconductor device of claim 10, further comprising:
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conductor pads formed in the main surface of the semiconductor substrate, wherein the inductor element includes a pair of connection terminals electrically connected to the semiconductor substrate via the conductor pads.
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13. The semiconductor device of claim 12, wherein
the connection terminals and the conductor pads are connected via gold bumps. -
14. The semiconductor device of claim 10, wherein
the inductor element includes a winding having one or more turns. -
15. The semiconductor device of claim 12, wherein
the pair of connection terminals of the inductor element are oriented in the same direction. -
16. The semiconductor device of claim 10, wherein
there are a plurality of the inductor elements. -
17. The semiconductor device of claim 16, wherein
no two of the inductor elements are inductively coupled with each other. -
18. The semiconductor device of claim 16, wherein
at least two of the inductor elements are inductively coupled with each other.
Specification