ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

• US 20100289609A1
• Filed: 02/10/2010
• Published: 11/18/2010
• Est. Priority Date: 05/15/2009
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Ikuta, Hideo, Chen, Yueh-Lang, LIAO, WEN-HSIUNG, Hsieh, Roger
• Granted Patent: US 8,518,190 B2
• Time in Patent Office: Days
• US Class Current: 336/221
• CPC Class Codes: B22F 3/12 Both compacting and sintering by forging B22F3/17
• CPC Class Codes: B22F 3/16 in successive or repeated steps
• CPC Class Codes: B22F 5/00 Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
• CPC Class Codes: B22F 7/08 with one or more parts not made from powder B22F7/062 takes precedence
• CPC Class Codes: H01F 1/22 pressed, sintered, or bound together
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2823 Wires H01F27/2866 takes precedence
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/32 Insulating of coils, windings, or parts thereof
• CPC Class Codes: H01F 3/08 made from powder powder coatings on sheets H01F3/02; on strips or ribbons H01F3/04; on wires H01F3/06
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence

Abstract

An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker'"'"'s Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.

Claims

1. An electronic device, comprising:

a magnetic body, comprising;

a first magnetic powder; and

a second magnetic powder, wherein the Vicker'"'"'s Hardness of the first magnetic powder is greater than the Vicker'"'"'s Hardness of the second magnetic powder, the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the first magnetic powder mixes with the second magnetic powder; and

a wire.

2. The electronic device according to claim 1, wherein the Vicker'"'"'s Hardness of the first magnetic powder is greater than or equal to 150 and the Vicker'"'"'s Hardness of the second magnetic powder is smaller than or equal to 100.

3. The electronic device according to claim 1, wherein the Vicker'"'"'s Hardness of the first magnetic powder is greater than or equal to 250 and the Vicker'"'"'s Hardness of the second magnetic powder is smaller than or equal to 80.

4. The electronic device according to claim 1, wherein the mean particle diameter of the first magnetic powder is substantially 10 μ

m to 40 μ

m.

5. The electronic device according to claim 1, wherein the mean particle diameter of the second magnetic powder is smaller than or equal to 10 μ

m.

6. The electronic device according to claim 1, wherein the mean particle diameter of the second magnetic powder is smaller than or equal to 4 μ

m.

7. The electronic device according to claim 1, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is larger than 2.

8. The electronic device according to claim 1, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is 2.5-10.

9. The electronic device according to claim 1, wherein a material of the first magnetic powder comprises metal alloy.

10. The electronic device according to claim 1, wherein a material of the first magnetic powder comprises Fe—

Cr—

Si alloy, Fe—

Ni alloy, amorphous alloy, Fe—

Si alloy, or Fe—

Al—

Si alloy.

11. The electronic device according to claim 1, wherein a material of the second magnetic powder comprises iron or ferroalloy.

12. The electronic device according to claim 1, wherein a material of the first magnetic powder comprises amorphous alloy, and a material of the second magnetic powder comprises iron.

13. The electronic device according to claim 1, wherein the ratio of the weight of the first magnetic powder to the weight of the second magnetic powder is 0.25-4.

14. The electronic device according to claim 1, wherein when a material of the first magnetic powder comprises amorphous alloy and a material of the second magnetic powder comprises iron, the ratio of the weight of the first magnetic powder to the weight of the second magnetic powder is 0.67-1.5.

15. The electronic device according to claim 1, wherein when a material of the first magnetic powder comprises Fe—

Cr—

Si alloy and a material of the second magnetic powder comprises iron, the ratio of the weight of the first magnetic powder to the weight of the second magnetic powder is 1.5-4.

16. The electronic device according to claim 1, wherein the wire comprises a buried part buried in the magnetic body or a winding part winding on the magnetic body.

17. The electronic device according to claim 1, wherein the magnetic body is manufactured by a molding process, and the molding pressure of the molding process is 6 t/cm²-11 t/cm².

18. An electronic device, comprising:

a magnetic body, comprising;

a first magnetic powder; and

a second magnetic powder, wherein the Vicker'"'"'s Hardness of the first magnetic powder is greater than the Vicker'"'"'s Hardness of the second magnetic powder, the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the first magnetic powder mixes with the second magnetic powder;

an adhesive, joining the first magnetic powder and the second magnetic powder; and

a wire.

19. The electronic device according to claim 18, wherein the content of the adhesive is 2 wt %-3 wt % of the total weight of the magnetic body.

20. The electronic device according to claim 19, wherein a material of the adhesive is thermoset resin.