ENCAPSULATED ELECTROMECHANICAL DEVICES
First Claim
Patent Images
1. An electromechanical device, comprising:
- a substrate;
an electromechanical element on the substrate, the electromechanical element comprising a movable component;
a layer encapsulating the electromechanical element, wherein the layer is planarized; and
an electronic element on or over the layer.
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Accused Products
Abstract
Encapsulation is provided to electromechanical devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer.
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Citations
19 Claims
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1. An electromechanical device, comprising:
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a substrate; an electromechanical element on the substrate, the electromechanical element comprising a movable component; a layer encapsulating the electromechanical element, wherein the layer is planarized; and an electronic element on or over the layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification