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Power Semiconductor Heatsinking

  • US 20100290195A1
  • Filed: 05/14/2009
  • Published: 11/18/2010
  • Est. Priority Date: 05/14/2009
  • Status: Active Grant
First Claim
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1. A heatsink comprising:

  • a thermally conductive body including a plurality of fins configured to conduct and dissipate heat, the body being configured to receive a circuit board containing a plurality of heat-producing electrical components along a width of the body;

    a pivot mechanism pivotally coupled to the body and configured and disposed to contact the plurality of heat-producing electrical components; and

    a bias device connected to the body and the pivot mechanism and configured to change from a first state to a second state to cause the pivot mechanism to rotate relative to the body to move a contact portion of the pivot mechanism toward the body;

    the heatsink being configured to receive the heat-producing electrical components between the contact portion of the pivot mechanism and the body; and

    the bias device being configured to bias the contact portion of the pivot mechanism to urge the heat-producing electrical components against the body when the bias device is in the second state.

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