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ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

  • US 20100290201A1
  • Filed: 04/13/2010
  • Published: 11/18/2010
  • Est. Priority Date: 05/13/2009
  • Status: Active Grant
First Claim
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1. An electronic component, comprising:

  • an electronic element;

    a housing case for housing the electronic element in a hollow portion defined inside the housing case;

    via electrodes that are electrically connected to electrodes of the electronic element,the via electrodes being formed from an inside of the housing case to an outside of the housing case; and

    outer electrodes that are electrically connected to the via electrodes,the outer electrodes being formed on a bottom surface of the housing case,wherein the outer electrodes are each formed by including;

    a first metal layer that is formed on the bottom surface of the housing case and is to be soldered to electrodes of a circuit board;

    a second metal layer that is formed on a surface of the first metal layer and is to be dissolved into solder; and

    a third metal layer that is formed on a surface of the second metal layer and is to be hardly dissolved into solder.

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