SILICON BASED CAPACITIVE MICROPHONE

• US 20100290644A1
• Filed: 11/27/2009
• Published: 11/18/2010
• Est. Priority Date: 05/15/2009
• Status: Active Grant

• Current Assignee: AAC Acoustic Technologies Company Limited, American Audio Components, Inc.
• Original Assignee: AAC Acoustic Technologies Company Limited, American Audio Components, Inc.
• Inventors: WU, ZHI-JIANG, SU, YONG-ZE
• Granted Patent: US 8,379,881 B2
• Time in Patent Office: Days
• US Class Current: 381/111
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.

Claims

1. A silicon based capacitive microphone, comprising:

a first printed circuit board;

a second printed circuit board far away from the first printed circuit board;

a transducer electrically mounted on the first printed circuit board;

a controlling chip electrically mounted on the second printed circuit board; and

a connecting member located between the first and second printed circuit boards, with one end electrically connected to a plurality of first conductive areas on the first printed circuit board, and the other end connected to a plurality of second conductive areas on the second printed circuit board.

2. The silicon based capacitive microphone as described in claim 1, wherein the connecting member includes a supporting body with through holes, and a plurality of connecting poles passing through the through holes.

3. The silicon based capacitive microphone as described in claim 2, wherein the supporting body defines an opening, and the transducer partially resides in the opening.

4. The silicon based capacitive microphone as described in claim 2, wherein the supporting body defines an opening, and the controlling chip partially resides in the opening.

5. The silicon based capacitive microphone as described in claim 1, wherein the first printed circuit board defines a sound aperture, and the transducer covers the sound aperture.

6. The silicon based capacitive microphone as described in claim further comprising a housing having a first aperture aligned with the sound aperture.

7. A silicon based capacitive microphone comprising:

a housing having a first aperture and a space;

a first printed circuit board received in the space;

a second printed circuit board opposed to the first printed circuit board;

a transducer mounted on the first printed circuit board;

a controlling chip mounted on the second printed circuit board; and

a connecting member arranged in the space with one end connected to the first printed circuit board and the other end connected to the second printed circuit board.

8. The silicon based capacitive microphone as described in claim 7, wherein the connecting member includes a supporting body and a plurality of connecting poles.

9. The silicon based capacitive microphone as described in claim 8, wherein the first printed circuit board comprises a plurality of first conductive areas and the second printed circuit board comprises a plurality of second conductive areas.

10. The silicon based capacitive microphone as described in claim 8, wherein the supporting body further includes an opening for partially receiving the transducer and the controlling chip.