Transducer package with interior support frame
First Claim
Patent Images
1. A transducer package, comprising:
- an audio transducer;
a substrate with an upper substrate surface and a lower substrate surface, wherein said lower substrate surface further comprises a plurality of contact pads;
a support frame attached to said substrate and comprising an audio transducer mounting flange and an acoustic aperture located within said audio transducer mounting flange, said audio transducer mounted to said audio transducer mounting flange, said support frame defining at least a first acoustic cavity volume in acoustic communication with an upper surface of said audio transducer and a second acoustic cavity volume in acoustic communication with a lower surface of said audio transducer; and
a cover attached to said substrate and to said support frame, said cover comprising an acoustic port in acoustic communication with said first acoustic cavity volume.
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Abstract
A surface mountable package for use with an audio transducer is provided. In addition to the audio transducer, the surface mountable package includes a substrate, a cover, and a transducer support frame mounted within, and attached to, the substrate and cover. The support frame includes one or more cavities that, in combination with the audio transducer, substrate and cover, define the front and rear acoustic cavity volumes.
13 Citations
29 Claims
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1. A transducer package, comprising:
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an audio transducer; a substrate with an upper substrate surface and a lower substrate surface, wherein said lower substrate surface further comprises a plurality of contact pads; a support frame attached to said substrate and comprising an audio transducer mounting flange and an acoustic aperture located within said audio transducer mounting flange, said audio transducer mounted to said audio transducer mounting flange, said support frame defining at least a first acoustic cavity volume in acoustic communication with an upper surface of said audio transducer and a second acoustic cavity volume in acoustic communication with a lower surface of said audio transducer; and a cover attached to said substrate and to said support frame, said cover comprising an acoustic port in acoustic communication with said first acoustic cavity volume. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A transducer package, comprising:
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an audio transducer; a substrate with an upper substrate surface and a lower substrate surface, wherein said lower substrate surface further comprises a plurality of contact pads; a support frame attached to said substrate and comprising an audio transducer mounting flange and an acoustic aperture located within said audio transducer mounting flange, said audio transducer mounted to said audio transducer mounting flange, said support frame defining at least a first acoustic cavity volume in acoustic communication with an upper surface of said audio transducer and a second acoustic cavity volume in acoustic communication with a lower surface of said audio transducer; a cover attached to said substrate and to said support frame; and an acoustic port in acoustic communication with said second acoustic cavity volume, wherein said substrate comprises said acoustic port.
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23. A surface mountable transducer package, comprising:
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a microphone transducer; a substrate with an upper substrate surface and a lower substrate surface, wherein said lower substrate surface further comprises a plurality of contact pads; an integrated circuit (IC) mounted to said upper substrate surface, wherein said IC is electrically connected to at least some of said plurality of contact pads; a support frame comprising; a transducer mounting flange and an acoustic aperture located within said transducer mounting flange, wherein said microphone transducer is sealed to said transducer mounting flange, and wherein said microphone transducer is electrically connected to said IC; a first recess within an upper portion of said support frame, wherein said transducer mounting flange and said microphone transducer are positioned within said first recess, and wherein said first recess is acoustically coupled to a first surface of said microphone transducer; a second recess within a lower portion of said support frame, wherein said second recess is acoustically coupled to a second surface of said microphone transducer; and a cavity extending through said support frame and acoustically coupled to said second recess; and a cover comprising; an inner cover surface sealed to an upper edge of said support frame, wherein a first acoustic cavity volume is defined by said first recess and a first portion of said inner cover surface, and wherein a second acoustic cavity volume is defined by said second recess, said cavity, a second portion of said inner cover surface, and said upper substrate surface; and an acoustic port in acoustic communication with said first acoustic cavity volume. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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Specification