METHODS AND APPARATUSES RELATING TO FINDABLE BALLS

• US 20100293777A1
• Filed: 08/02/2010
• Published: 11/25/2010
• Est. Priority Date: 09/26/2003
• Status: Abandoned Application

• Current Assignee: Chris Savarese, Harold W. Ng, Lauro C. Cadorniga, Noel H.C. Marshall, Susan Mcgill
• Original Assignee: Chris Savarese, Harold W. Ng, Lauro C. Cadorniga, Noel H.C. Marshall, Susan Mcgill
• Inventors: Marshall, Noel H.C., Savarese, Chris, McGill, Susan, Cadorniga, Lauro C., Ng, Harold W.
• Application Number:
  US12/848,962
• Publication Number:
  US 20100293777A1
• Time in Patent Office: Days
• US Class Current: 29/593
• CPC Class Codes: A63B 2024/0053 for locating an object, e.g. a lost ball
• CPC Class Codes: A63B 2225/50 Wireless data transmission, e.g. by radio transmitters or telemetry
• CPC Class Codes: A63B 24/0021 Tracking a path or terminating locations
• CPC Class Codes: A63B 37/0003 Golf balls
• CPC Class Codes: A63B 37/0055 with non-spherical insert(s)
• CPC Class Codes: A63B 37/0088 Frequency
• CPC Class Codes: A63B 43/00 Balls with special arrangements
• CPC Class Codes: A63B 45/00 Apparatus or methods for manufacturing balls working of plastics or substances in a plastic state B29
• CPC Class Codes: G01S 13/04 Systems determining presence of a target based on relative movement of target G01S13/56
• CPC Class Codes: G01S 13/75 using transponders powered from received waves, e.g. using passive transponders , or using passive reflectors
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.

Claims

1. A method of fabricating a golf ball, the method comprising:

applying an antenna to a core of a golf ball;

coupling a semiconductor component to the antenna;

testing the antenna and the semiconductor component for a radio frequency response;

applying a material to enclose the core and the semiconductor component and the antenna within the material if the radio frequency (RF) response is acceptable.

2. A method as in claim 1, wherein the applying of the material comprises injection molding the material and wherein the antenna and the semiconductor component are tested again for an RF response after applying the material.

3. A method as in claim 1, the method further comprising:

applying an additional antenna to the core;

coupling an additional semiconductor component to the additional antenna wherein the material also encloses the additional antenna and the additional semiconductor component;

and wherein the semiconductor component is at least partially disposed in a first void with a first filler material and the additional semiconductor component is at least partially disposed in a second void with a second filler material and wherein the first filler material and the semiconductor component occupy substantially all space in the first void and the second filler material and the additional semiconductor component occupy substantially all space in the second void.

4. A method as in claim 1, the method further comprising:

depositing a filler material into a void on a surface of the core of a golf ball;

depositing the semiconductor component at least partially into the void;

curing the filler material at a temperature of less than about 90°

F.

5. A method as in claim 4, wherein the curing is at a temperature of about 65°

F. to 75°

F. and a relative humidity of about 30% to 60% and for a period of time less than about 120 minutes.

6. A method as in claim 1, the method further comprising:

coating the core after the semiconductor component has been coupled to the antenna with a first material which is compatible with the material which is a shell material.

7. A method as in claim 6, wherein a connection between the semiconductor component and the antenna is cured before coating the core.

8. A method as in claim 1, the method further comprising:

placing the core of the golf ball into a fixture;

aligning a feature on the core relative to a registration position of the fixture, the feature having a predetermined position relative to a void on the core.

9. A method as in claim 8 further comprising:

depositing the semiconductor component at least partially in the void; and

wherein the aligning is optically performed.

10. A method as in claim 1, the method further comprising:

applying a filler material into a void of the core of the golf ball, the filler material occupying a first volume when it is applied;

curing the filler material, the filler material occupying substantially the first volume after the curing.

11. A method as in claim 10 further comprising:

depositing the semiconductor component at least partially into the void, the semiconductor component being surrounded on its sides and bottom by the filler material as the filler material is curing.

12. A method as in claim 11 further comprising:

removing any excess of the filler material with a solvent, wherein the solvent does not effect the antenna which is an elastic conductive antenna.

13. A method as in claim 11 wherein the curing is about 70°

F.

14. A method as in claim 11 wherein the filler material and the semiconductor component occupy substantially all space in the void.

15. A method as in claim 11 wherein the antenna is applied to the core by printing the antenna on the core.

16. A method of claim 1, the method further comprising:

coating the core material, after the semiconductor component has been coupled to the antenna, with a sealant to create a sealed core;

shipping the sealed core before applying the material to enclose the sealed core.

17. A method of claim 1, the method further comprising:

picking the semiconductor component with a robotic arm;

optically detecting a void on a surface of the core;

placing, with the robotic arm, the semiconductor component into the void.

18. A method of claim 1, the method further comprising:

attaching the core to a fixture;

aligning the core to receive the semiconductor component into a void;

attaching the semiconductor component to the void.