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SEMICONDUCTOR DEVICE

  • US 20100295140A1
  • Filed: 05/20/2009
  • Published: 11/25/2010
  • Est. Priority Date: 05/20/2009
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a housing defining a cavity;

    a magnetic sensor chip disposed in the cavity; and

    mold material covering the magnetic sensor chip and substantially filling the cavity;

    wherein one of the housing and the mold material is ferromagnetic and an other of the housing and the mold material is non-ferromagnetic.

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