Cover and method of manufacturing the same

• US 20100295286A1
• Filed: 05/13/2010
• Published: 11/25/2010
• Est. Priority Date: 05/13/2009
• Status: Abandoned Application

• Current Assignee: American Banknote S/A
• Original Assignee: American Banknote S/A
• Inventors: Mitterhofer, Erik, Goldstein, Keith E.
• Application Number:
  US12/800,474
• Publication Number:
  US 20100295286A1
• Time in Patent Office: Days
• US Class Current: 281/29
• CPC Class Codes: B42D 3/12 combined with other articles loose leaf-binders combined with other articles B42F13/40
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

An electronic cover for a passport, booklet or the like includes an electronic device and a layer of cover material that are bonded together by a fill-up adhesive layer, the electronic device preferably being in the form of an RFID inlay that includes a substrate, an antenna coupled to the substrate and an integrated circuit (IC) chip module conductively coupled to the antenna. During manufacture of the cover, the fill-up adhesive layer is applied to at least one of the electronic device and the layer of cover material. Immediately thereafter, the electronic device and the layer of cover material are held spaced apart from one another a predefined distance so as to define a void therebetween. Through a suitable trigger, the fill-up adhesive layer expands to fill in the entire void and subsequently cures to bond the electronic device to the layer of cover material.

Claims

1. A cover for a passport, booklet or the like, the cover comprising:

(a) an electronic device,

(b) a layer of cover material spaced apart from the electronic device, and

(c) a fill-up adhesive layer disposed between the electronic device and the layer of cover material, the fill-up adhesive layer being bonded directly to each of the electronic device and the layer of cover material.

2. The cover as claimed in claim 1 wherein the fill-up adhesive layer is in the form of a polyurethane foam.

3. The cover as claimed in claim 2 wherein the polyurethane foam includes a reaction product of:

(a) at least one isocyanate,

(b) at least one isocyanate-reactive component; and

(c) water.

4. The cover as claimed in claim 3 wherein the at least one isocyanate, the at least one isocyanate-reactive component and water are in the presence of at least one of blowing agents, surfactants, cross-linking agents, extending agents, pigments, flame retardants, catalysts and fillers.

5. The cover as claimed in claim 4 wherein the polyurethane foam has a free rise density of from about 5 lb/ft³ to about 25 lb/ft³, a reactive cream time of from about 10 seconds to about 120 seconds, and an elongation of from about 30% to about 300%.

6. The cover as claimed in claim 1 wherein the electronic device comprises:

(a) a substrate having a top surface and a bottom surface,

(b) an antenna coupled to at least one of the top and bottom surfaces of the substrate, and

(c) an integrated circuit (IC) chip module conductively coupled to the antenna.

7. The cover as claimed in claim 6 wherein the substrate is shaped to define an opening that extends from the top surface to the bottom surface.

8. The cover as claimed in claim 7 wherein the IC chip module comprises:

(a) a lead frame, and

(b) an IC chip conductively mounted on the lead frame.

9. The cover as claimed in claim 8 wherein the IC chip is at least partially encapsulated within an IC package.

10. The cover as claimed in claim 9 wherein the IC chip is coupled to the antenna such that the IC package at least partially projects into the opening defined in the substrate.

11. The cover as claimed in claim 1 wherein the layer of cover material is constructed of a material from the group consisting of cloth, synthetic cloth, cotton and composites thereof.

12. A method of manufacturing a cover for a passport, booklet or the like, the method comprising the steps of:

(a) providing an electronic device,

(b) providing a layer of cover material,

(c) applying a fill-up adhesive layer onto at least one of the electronic device and the layer of cover material,

(d) holding the layer of cover material and the electronic device apart from one another so as to define a void therebetween,

(e) expanding the fill-up adhesive layer to fill in the entire void between the electronic device and the layer of cover material, and

(f) curing the fill-up adhesive layer to bond the electronic device to the layer of cover material.

13. The method of claim 12 wherein the fill-up adhesive layer is in the form of a polyurethane foam.

14. The method of claim 13 wherein the polyurethane foam includes a reaction product of:

(a) at least one isocyanate,

(b) at least one isocyanate-reactive component; and

(c) water.

15. The method of claim 14 wherein the at least one isocyanate, the at least one isocyanate-reactive component and water are in the presence of at least one of blowing agents, surfactants, cross-linking agents, extending agents, pigments, flame retardants, catalysts and fillers.

16. The method of claim 15 wherein the polyurethane foam has a free rise density of from about 5 lb/ft³ to about 25 lb/ft³, a reactive cream time of from about 10 seconds to about 120 seconds, and an elongation of from about 30% to about 300%.

17. The method of claim 16 wherein the electronic device comprises:

(a) a substrate having a top surface and a bottom surface,

(b) an antenna coupled to at least one of the top and bottom surfaces of the substrate, and

(c) an integrated circuit (IC) chip module conductively coupled to the antenna.

18. The method of claim 17 wherein the layer of cover material is constructed of a material from the group consisting of cloth, synthetic cloth, cotton and composites thereof.

19. A cover for a passport, booklet or the like produced by the method of claim 12.

20. A cover for a passport, booklet or the like, the cover comprising:

(a) an electronic device having a top surface and a bottom surface, and

(b) a fill-up adhesive layer bonded directly onto one of the top and bottom surfaces of the electronic device, the fill-up adhesive layer having an exposed outer surface that is textured and colored to resemble a layer of cover material.