Smart Aerospace Structures

• US 20100295694A1
• Filed: 02/05/2010
• Published: 11/25/2010
• Est. Priority Date: 02/06/2009
• Status: Active Grant

• Current Assignee: University of Dayton
• Original Assignee: University of Dayton
• Inventors: Wolf, J. Douglas, Kauffman, Robert E.
• Granted Patent: US 8,395,521 B2
• Time in Patent Office: Days
• US Class Current: 340/665
• CPC Class Codes: G06K 19/0716 at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs

Abstract

Smart aerospace structures are described herein utilizing a deactivated RFID tag including an IC and an electrical by-pass. The electrical by-pass is conductive and the electrical by-pass is in parallel with the IC such that the deactivated RFID becomes activated upon an abnormal condition, such as an improper clamp installation, a clamp failure, an impact, a thermal event or a crack.

Claims

1. A smart aerospace structure comprising:

a deactivated Radio-frequency identification (RFID) tag comprising an integrated circuit (IC) and an electrical by-pass wherein;

the electrical by-pass is conductive;

the electrical by-pass is in parallel with the IC; and

the deactivated RFID tag becomes activated when the by-pass becomes nonconductive upon an abnormal condition;

where the abnormal condition comprises an improper clamp installation, a clamp failure, an impact, a thermal event or a crack.

2. The smart aerospace structure of claim 1 further comprising a clamp body with a first mating surface and a second mating surface wherein:

the abnormal condition comprises an improper clamp installation or clamp failure;

the electrical by-pass is embedded in the clamp body for supporting electrical wiring;

wherein when the first mating surface and the second mating surface are in contact the clamp body is in a closed position, the clamp body forms an enclosure, and the electrical by-pass is conductive; and

wherein when the first mating surface and the second mating surface are separated the clamp body is in an open position, and the electrical by-pass is nonconductive.

3. The smart aerospace structure of claim 1 wherein:

the abnormal condition comprises an impact; and

the electrical by-pass comprises a breakable trace configured to break upon the impact;

wherein when the breakable trace breaks, the electrical by-pass is nonconductive.

4. The smart aerospace structure of claim 1 wherein:

the abnormal condition comprises a thermal event; and

the electrical by-pass comprises a reactive material configured to react to chemical species resulting from the thermal event;

wherein when the reactive material reacts, the electrical by-pass is nonconductive.

5. The smart aerospace structure of claim 1 wherein:

the abnormal condition comprises a thermal event; and

the electrical by-pass comprises a melting material configured to melt during the thermal event;

wherein when the melting material melts, the electrical by-pass is nonconductive.

6. The smart aerospace structure of claim 1 further comprising a composite material wherein:

the abnormal condition is the crack in the composite material; and

the electrical by-pass comprises a breakable trace configured to break upon a formation of the crack in the composite material;

wherein when the breakable trace breaks, the electrical by-pass is nonconductive.