EFFICIENT LED ARRAY

• US 20100297794A1
• Filed: 08/02/2010
• Published: 11/25/2010
• Est. Priority Date: 09/29/2008
• Status: Active Grant

• Current Assignee: BX LED LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Bridgelux Incorporated
• Inventors: Helbing, Rene Peter
• Granted Patent: US 8,092,051 B2
• Time in Patent Office: Days
• US Class Current: 438/27
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21S 6/00 Lighting devices intended to be free-standing F21S9/00, F21S10/00, F21S13/12 take precedence lighting devices specially adapted to be transported from place to place, e.g. lighting devices carried on wheeled supports F21L; details of supports for lighting devices F21V21/00
• CPC Class Codes: F21S 8/08 with a standard F21S6/00 takes precedence
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

Claims

1. A method for forming a light emitting diode (LED) apparatus, the method comprising:

configuring a metal substrate to have a reflective surface; and

mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

2. The method of claim 1, wherein said configuring comprises configuring the reflective surface to comprise polished aluminum.

3. The method of claim 1, wherein said configuring comprises configuring the reflective surface to comprise silver plating

4. The method of claim 1, wherein said configuring comprises configuring the reflective surface to have a reflectivity of 70% or greater.

5. The method of claim 1, further comprising forming an array having a chip spacing that is approximately 0.5 millimeters or greater from the at least a portion of the LED chips.

6. The method of claim 1, further comprising configuring the plurality of LED chips to provide separate thermal and electrical paths.

7. The method of claim 1 further comprising configuring the plurality of LED chips to have a first surface that is mounted to the reflective surface, and electrical contacts that are provided on one or more surfaces that are not the first surface.

8. The method of claim 1, further comprising mounting the metal substrate directly to a heat sink.