ISOLATED ACTIVE TEMPERATURE REGULATOR FOR VACUUM PACKAGING OF A DISC RESONATOR GYROSCOPE
First Claim
1. An apparatus for isolating a MEMS die, comprising:
- a top layer comprising a resistive heater for regulating temperature of the MEMS die; and
a bottom layer comprising a bottom layer central region, one or more bottom layer periphery regions and a plurality of substantially radial bottom layer isolation beams, each extending from the bottom layer central region to one of the one or more bottom layer periphery regions;
wherein an upper surface of the top layer is bonded to the MEMS die and a lower surface of the top layer is bonded to the bottom layer and a temperature sensor is used with the resistive heater to regulate the temperature of the MEMS die.
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Abstract
A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.
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Citations
28 Claims
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1. An apparatus for isolating a MEMS die, comprising:
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a top layer comprising a resistive heater for regulating temperature of the MEMS die; and a bottom layer comprising a bottom layer central region, one or more bottom layer periphery regions and a plurality of substantially radial bottom layer isolation beams, each extending from the bottom layer central region to one of the one or more bottom layer periphery regions; wherein an upper surface of the top layer is bonded to the MEMS die and a lower surface of the top layer is bonded to the bottom layer and a temperature sensor is used with the resistive heater to regulate the temperature of the MEMS die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of producing an isolator for a MEMS die, comprising:
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producing a top layer comprising a resistive heater for regulating temperature of the MEMS die; etching a bottom layer comprising a bottom layer central region, one or more bottom layer periphery regions and a plurality of substantially radial bottom layer isolation beams, each extending from the bottom layer central region to one of the one or more bottom layer periphery regions; bonding a lower surface of the top layer to the bottom layer; and bonding an upper surface of the top layer to the MEMS die; wherein a temperature sensor is used with the resistive heater to regulate the temperature of the MEMS die. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. An apparatus for isolating a MEMS die, comprising:
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a top layer comprising a temperature isolation means for substantially actively regulating a temperature of the MEMS die; and a bottom layer comprising mechanical isolation means for substantially isolating vibration of the MEMS die; wherein an upper surface of the top layer is bonded to the MEMS die and a lower surface of the top layer is bonded to the bottom layer. - View Dependent Claims (28)
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Specification