Light emitting element

• US 20100301357A1
• Filed: 02/12/2008
• Published: 12/02/2010
• Est. Priority Date: 01/04/2008
• Status: Active Grant

• Current Assignee: Lextar Electronics Corporation
• Original Assignee: Lextar Electronics Corporation
• Inventors: Chen, Wei-An, Fan, Chu-Ping
• Granted Patent: US 8,294,173 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83951 Forming additional members, e.g. for reinforcing, fillet sealant
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

The present invention discloses a light emitting element including a carrier, at least one light emitting chip, an adhesive and a first encapsulated layer. The light emitting chip is fixed onto the carrier by the adhesive, and most of the carrier and adhesive are made of a light absorbing material, so that the external luminescence quantum efficiency of the light emitting element is poor. The invention adopts a first encapsulated layer disposed on the carrier to cover the light absorbing material including the adhesive or carrier, so as to reduce the light absorption and improve the external luminescence quantum efficiency of the light emitting element.

Claims

1. A light emitting element, comprising:

a carrier;

at least one light emitting chip, installed on the carrier; and

a first encapsulated layer, disposed on the carrier, and covered onto a light absorbing material.

2. The light emitting element of claim 1, wherein the light absorbing material is an adhesive or a carrier.

3. The light emitting element of claim 2, wherein the adhesive is a silver adhesive.

4. The light emitting element of claim 1, wherein the first encapsulated layer includes a package material and a medium.

5. The light emitting element of claim 4, wherein the medium is composed of refractive particles, bubbles or reflective particle.

6. The light emitting element of claim 5, wherein the refractive particle has a refractive index of 1.5 to 5.0.

7. The light emitting element of claim 4, wherein the medium has a particle diameter of 20 nm to 5 μ

m.

The light emitting element of claim 4, wherein the medium is made of a material selected from the collection of titanium dioxide (TiO₂), zinc oxide (ZnO), aluminum nitride (AlN), aluminum oxide (Al₂O₃) and barium carbonate (BaCO₃).

8. The light emitting element of claim 1, wherein the first encapsulated layer has a height lower than the light emitting chip.

9. The light emitting element of claim 8, wherein the first encapsulated layer further comprises a second encapsulated layer.

10. The light emitting element of claim 1, wherein the first encapsulated layer further covers the carrier.

11. A light emitting element, comprising:

a carrier;

at least one light emitting chip, installed on the carrier; and

a first encapsulated layer, disposed adjacent to the light emitting chip, for covering a light absorbing material, and exposing the light emitting chip.

12. The light emitting element of claim 11, further comprising an adhesive between the light emitting chip and the carrier.

13. The light emitting element of claim 12, wherein the adhesive is made of a light absorbing material, and the first encapsulated layer covers the adhesive.

14. The light emitting element of claim 11, wherein the first encapsulated layer includes a package material and a medium.

15. The light emitting element of claim 14, wherein the medium is composed of refractive particles, bubbles or reflective particle.

16. The light emitting element of claim 15, wherein the refractive particle has a refractive index of 1.5 to 5.0.

17. The light emitting element of claim 11, wherein the medium has a particle diameter of 20 nm to 5 μ

m.

18. The light emitting element of claim 11, wherein the medium is made of a material selected from the collection of titanium dioxide (TiO₂), zinc oxide (ZnO), aluminium nitride (AlN), aluminum oxide (Al₂O₃) and barium carbonate (BaCO₃).

19. The light emitting element of claim 11, wherein the first encapsulated layer has a height lower than the light emitting chip.

20. The light emitting element of claim 19, wherein the first encapsulated layer further comprises a second encapsulated layer.