LED PACKAGE STRUCTURE
First Claim
Patent Images
1. A light emitting diode (LED) package structure, comprising:
- a lead frame;
an LED chip disposed on the lead frame;
a fuse disposed on the lead frame and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series; and
an encapsulation covering the LED chip, the fuse and at least a part of the lead frame.
2 Assignments
0 Petitions
Accused Products
Abstract
An LED package structure includes a lead frame, an LED chip disposed on the lead frame, a fuse disposed on the lead frame and electrically connected to the lead frame, and an encapsulation. The fuse is electrically connected to the LED chip in series.
12 Citations
11 Claims
-
1. A light emitting diode (LED) package structure, comprising:
-
a lead frame; an LED chip disposed on the lead frame; a fuse disposed on the lead frame and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series; and an encapsulation covering the LED chip, the fuse and at least a part of the lead frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
Specification