×

LED PACKAGE STRUCTURE

  • US 20100301374A1
  • Filed: 08/13/2009
  • Published: 12/02/2010
  • Est. Priority Date: 05/27/2009
  • Status: Active Grant
First Claim
Patent Images

1. A light emitting diode (LED) package structure, comprising:

  • a lead frame;

    an LED chip disposed on the lead frame;

    a fuse disposed on the lead frame and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series; and

    an encapsulation covering the LED chip, the fuse and at least a part of the lead frame.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×