INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES
First Claim
Patent Images
1. A device comprising:
- a substrate comprising a first material;
a mechanical resonator comprising a piezoelectric material, different from the first material,wherein the mechanical resonator is integrated with the substrate.
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Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
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Citations
47 Claims
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1. A device comprising:
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a substrate comprising a first material; a mechanical resonator comprising a piezoelectric material, different from the first material, wherein the mechanical resonator is integrated with the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A device comprising:
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a substrate comprising a first material; and a mechanical resonator comprising quartz and integrated with the substrate, wherein the first material is not quartz. - View Dependent Claims (21, 22, 23, 24, 26, 27, 28)
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25. The device of 23, further comprising integrated circuitry formed on the cap and coupled to the mechanical resonator to control the mechanical resonator
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29. A device comprising:
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a substrate comprising a first material; a mechanical resonator comprising a single crystal piezoelectric material, different from the first material, and integrated with the substrate; and integrated circuitry coupled to the mechanical resonator. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A device comprising:
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a substrate formed of a semiconductor material comprising silicon; a mechanical resonator comprising quartz and integrated with the substrate; and integrated circuitry formed on the substrate and coupled to the mechanical resonator to control operation of the mechanical resonator and/or to detect vibration of the mechanical resonator. - View Dependent Claims (36, 37, 38, 39, 40)
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41. A method of fabricating a device, the method comprising:
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bonding a wafer comprising a piezoelectric material to a wafer comprising a first material, the first material being different than the piezoelectric material; and forming a mechanical resonator from the wafer of the piezoelectric material. - View Dependent Claims (42, 43, 44, 45, 46, 47)
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Specification