HIGH POWER SOLID STATE POWER CONTROLLER PACKAGING

• US 20100302729A1
• Filed: 05/27/2009
• Published: 12/02/2010
• Est. Priority Date: 05/27/2009
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: TEGART, DON, LIU, ZHENNING
• Application Number:
  US12/472,596
• Publication Number:
  US 20100302729A1
• Time in Patent Office: Days
• US Class Current: 361/692
• CPC Class Codes: H05K 7/1457 Power distribution arrangements
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.

Claims

1. A high power solid state power controller packaging system, comprising:

a plurality of discrete power devices assembled juxtaposed to one another in a row;

a fin style heatsink for transference of heat away from the discrete power devices, wherein the plurality of discrete power devices are mounted planar and onto the heatsink;

an input bus bar and an output bus bar mounted within the packaging system in electrical connection with the plurality of discrete power devices; and

a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices.

2. The high power solid state power controller packaging system of claim 1, further comprising a control connector connected to the circuit card assembly receiving signals from an aircraft level power control system.

3. The high power solid state power controller packaging system of claim 1, further comprising a current measurement device connected to the output bus bar for measuring output current in the system.

4. The high power solid state power controller packaging system of claim 1, wherein the input bus bar includes a twist.

5. A high power solid state power control module, comprising:

a housing;

a direct copper bond plate mounted in the housing;

a plurality of power dies mounted onto a first side of the direct copper bond plate;

an input bus bar and an output bus bar mounted in the housing in connection with and for transferring power into and away from the plurality of power dies;

a circuit card assembly mounted in the housing spaced from the direct copper bond plate;

a set of interconnect pins for providing an electrical connection to the plurality of power dies using wiring bonding; and

a fin style heatsink mounted to a second side of the direct copper bond plate.

6. The high power solid state power control module of claim 5, further comprising a controller connector connected to the circuit card assembly for transmitting control signals to the power dies.

7. The high power solid state power control module of claim 5, wherein the input bus bar and output bus bar make contact with both the circuit card assembly and the direct copper bond plate.

8. The high power solid state power control module of claim 5, wherein the input bus bar and output bus bar protrude externally from ends of the module.

9. A high power solid state power control power panel, comprising:

a chassis;

a mounting bracket mounted in the chassis;

a plurality of connector sockets formed in the mounting bracket; and

a plurality of high power solid state power control modules modularly mounted electrically and physically in parallel to one another on the mounting bracket, wherein the connector sockets are configured to modularly receive respective high power solid state power control modules.

10. The high power solid state power control power panel of claim 9 further comprising a current measurement device connected to each respective high power solid state power control module.

11. The high power solid state power control power panel of claim 9 further comprising an air inlet on the chassis and an air outlet on the chassis configured to provide air flow in and out of the chassis.

12. The high power solid state power control power panel of claim 11, wherein the high power solid state power control modules each respectively include a heat sink configured to promote cooling airflow out of the air outlet.

13. The high power solid state power control power panel of claim 11, wherein the chassis includes walls configured to promote cooling airflow out of the air outlet.

14. The high power solid state power control power panel of claim 9, further comprising a control motherboard mounted onto the chassis for controlling signals in the high power solid state power control modules.

15. The high power solid state power control power panel of claim 9, further comprising:

an input wire bundle connected to respective high power solid state power control modules for providing power into each respective high power solid state power control module; and

an output wire bundle connected to respective high power solid state power control modules for transmitting power out from each respective high power solid state power control module.

16. The high power solid state power control power panel of claim 9, wherein the high power solid state power control module are liquid cooled.

17. The high power solid state power control power panel of claim 9, further comprising:

chassis fluid fittings mounted to the chassis;

a fluid manifold in fluid connection with the chassis fluid fittings; and

module fluid fittings mounted on the high power solid state power control modules in fluid connection with the fluid manifold.