Touch Panel Manufacturing Method

• US 20100304013A1
• Filed: 06/01/2009
• Published: 12/02/2010
• Est. Priority Date: 06/01/2009
• Status: Abandoned Application

• Current Assignee: Eturbotouch Technology Inc.
• Original Assignee: Eturbotouch Technology Inc.
• Inventors: WANG, Xuei-Min
• Application Number:
  US12/476,252
• Publication Number:
  US 20100304013A1
• Time in Patent Office: Days
• US Class Current: 427/58
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

Abstract

In a touch panel manufacturing method, a substrate is prepared, a sensing layer and a protective layer are sequentially formed on the substrate, an electrode layer with spaced electrodes is formed by firing, and the electrode layer is penetrated through the protective layer and formed on a surface of the sensing layer. Since the sensing layer is covered by the protective layer before forming the electrode layer, the sensing layer can be avoided to be influenced by accompanying heat, chemical substances and/or oxygen gas, its intrinsic physical characteristics are retained and its periphery would not be damaged. Moreover, since the formation of the protective layer is prior to the electrode layer, the height difference formed at the periphery of the electrode layer and the optical interference phenomena both are prevented. Finally, the manufacturing process is simplified and thus production speed and production capacity are increased.

Claims

1. A touch panel manufacturing method comprising:

preparing a substrate;

sequentially forming a sensing layer and a protective layer on a surface of the substrate in that order;

forming an electrode layer with spaced electrodes by a firing process; and

the electrode layer being penetrated through the protective layer and formed on a surface of the sensing layer.

2. The touch panel manufacturing method as claimed in claim 1, wherein during the step of sequentially forming the sensing layer and the protective layer on the surface of the substrate, a method for the formation of each of the sensing layer and the protective layer is selected from the group consisting of dip coating, embossing, sputtering, evaporation, chemical vapor deposition, screen printing and pad printing.

3. The touch panel manufacturing method as claimed in claim 1, wherein the electrode layer is made of copper or aluminum.

4. The touch panel manufacturing method as claimed in claim 1, wherein the protective layer is made of one of cyclo-olefin copolymer, polyethylene terephthalate, silicon dioxide and plastic.

5. The touch panel manufacturing method as claimed in claim 1, wherein the electrode layer is comprised of electrodes in the form of electrode strips arranged in a spaced manner, or in the form of electrode blocks arranged in matrix, or in the form of electrode blocks arranged in array.

6. The touch panel manufacturing method as claimed in claim 1, wherein the sensing layer is made of indium tin oxide.

7. A touch panel manufacturing method comprising:

preparing a substrate;

forming a first sensing layer and a second sensing layer respectively on a first surface and a second surface of the substrate;

forming a first protective layer and a second protective layer respectively on the first sensing layer and the second sensing layer;

forming a first electrode layer with spaced electrodes and a second electrode layer with spaced electrodes by a firing process; and

the first electrode layer and the second electrode layer respectively being penetrated through the first protective layer and the second protective layer and formed on a surface of the first sensing layer and a surface of the second sensing layer.

8. The touch panel manufacturing method as claimed in claim 7, wherein during the step of forming the first sensing layer and the second sensing layer respectively on the first surface and the second surface of the substrate, a method for the formation of each of the first sensing layer and the second sensing layer is selected from the group consisting of dip coating, embossing, sputtering, evaporation, chemical vapor deposition, screen printing and pad printing.

9. The touch panel manufacturing method as claimed in claim 7, wherein during the step of forming the first protective layer and the second protective layer respectively on first sensing layer and the second sensing layer, a method for the formation of each of the first protective layer and the second protective layer is selected from the group consisting of dip coating, embossing, sputtering, evaporation, chemical vapor deposition, screen printing and pad printing.

10. The touch panel manufacturing method as claimed in claim 7, wherein the first electrode layer and the second electrode layer are made of copper or aluminum.

11. The touch panel manufacturing method as claimed in claim 7, wherein each of the first electrode layer and the second electrode layer is comprised of electrodes in the form of electrode strips arranged in a spaced manner, or in the form of electrode blocks arranged in matrix, or in the form of electrode blocks arranged in array.

12. The touch panel manufacturing method as claimed in claim 7, wherein the first sensing layer and the second sensing layer are made of indium tin oxide.

13. The touch panel manufacturing method as claimed in claim 7, wherein the first protective layer and the second protective layer are made of one of cyclo-olefin copolymer, polyethylene terephthalate, silicon dioxide and plastic.

14. A touch panel manufacturing method comprising:

preparing a substrate;

sequentially forming a first sensing layer and a first protective layer on a first surface of the substrate in that order;

forming a first electrode layer with spaced electrodes by a firing process;

the first electrode layer being penetrated through the first protective layer and formed on a surface of the first sensing layer;

sequentially forming a second sensing layer and a second protective layer on a second surface of the substrate in that order;

forming a second electrode layer with spaced electrodes by a firing process; and

the second electrode layer being penetrated through the second protective layer and formed on a surface of the second sensing layer.

15. The touch panel manufacturing method as claimed in claim 14, wherein during the step of sequentially forming the first sensing layer and the first protective layer on the first surface of the substrate, a method for the formation of each of the first sensing layer and the first protective layer is selected from the group consisting of dip coating, embossing, sputtering, evaporation, chemical vapor deposition, screen printing and pad printing.

16. The touch panel manufacturing method as claimed in claim 14, wherein during the step of sequentially forming the second sensing layer and the second protective layer on the second surface of the substrate, a method for the formation of each of the second sensing layer and the second protective layer is selected from the group consisting of dip coating, embossing, sputtering, evaporation, chemical vapor deposition, screen printing and pad printing.

17. The touch panel manufacturing method as claimed in claim 14, wherein the first layer electrode layer and the second electrode layer are made of metal for example copper or aluminum.

18. The touch panel manufacturing method as claimed in claim 14, wherein each of the first electrode layer and the second electrode layer is comprised of electrodes in the form of electrode strips arranged in a spaced manner, or in the form of electrode blocks arranged in matrix, or in the form of electrode blocks arranged in array.

19. The touch panel manufacturing method as claimed in claim 14, wherein the first sensing layer and the second sensing layer are made of indium tin oxide.

20. The touch panel manufacturing method as claimed in claim 14, wherein the first protective layer and the second protective layer are made of one of cyclo-olefin copolymer, polyethylene terephthalate, silicon dioxide and plastic.