Method and Apparatus for Detethering Mesoscale, Microscale, and Nanoscale Components and Devices

• US 20100306993A1
• Filed: 11/20/2008
• Published: 12/09/2010
• Est. Priority Date: 11/20/2007
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Shiakolas, Panayoitis S., Mayyas, Mohammad A.
• Granted Patent: US 8,739,398 B2
• Time in Patent Office: Days
• US Class Current: 29/592.1
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device

Abstract

A method and apparatus for fabricating one or more electronic devices from wafer, die or other holder including designing a plurality of electronic devices (805), wherein each of the electronic devices is encapsulated in a cell and designing a plurality of tethers (825). Each tether includes a first end and a second end. The method includes selecting an attachment point (835, 860) on each of the plurality of electronic devices, attaching the first end of each of the plurality of tethers to one of the attachment points, selecting a plurality of anchor points (835, 860), attaching the second end of each of the plurality of tethers to one of the anchor points. The method includes determining a fracture condition (835) for each electronic device that breaks the tether at the first end (865). The fracture condition is same for a group of electronic devices in the plurality of electronic devices.

Claims

1. A method for forming an electronic device, comprising:

designing a tether, wherein the tether includes a first end and a second end;

selecting an attachment point on the electronic device;

attaching the first end of the tether to the attachment point, wherein the electronic device is encapsulated in a cell;

selecting an anchor point;

attaching the second end of the tether to the anchor point;

determining fracture conditions that break the tether at the first end;

agitating the cell at the fracture conditions to break the tether at the first end; and

separating the electronic device from the cell.

2. The method of claim 1, wherein the electronic device is encapsulated in the cell of a wafer, die, or other holder.

3. The method of claim 2, wherein the cell includes a cell frame.

4. The method of claim 3, wherein the anchor point is on the cell frame.

5. The method of claim 1, wherein the anchor point is a proof mass.

6. The method of claim 1, wherein the electronic device is a mesoscale, microscale or nanoscale device.

7. The method of claim 1, further comprising designing the electronic device, wherein the electronic device is one or more components.

8. The method of claim 7, wherein each component is attached to the cell by one or more tethers.

9. The method of claim 8, wherein the electronic device is a safety inertial sensor.

10. The method of claim 1, wherein the fracture conditions comprise agitation frequency, agitation amplitude, and directional agitation angle with respect to tether.

11. The method of claim 1, wherein the tether is linear breadth tapered cantilever beam, prismatic cantilever beam, tapered cantilever beam of truncated wedges, tapered cantilever beam of truncated cone, doubly-tapered cantilevered beam, or group of cantilever beams truncated at different shape-functions.

12. A method, comprising:

designing a plurality of electronic devices, wherein each of the electronic devices is encapsulated in a cell of a wafer, die or other holder;

designing a plurality of tethers, wherein each tether includes a first end and a second end;

selecting an attachment point on each of the plurality of electronic devices;

attaching the first end of each of the plurality of tethers to one of the attachment points;

selecting a plurality of anchor points;

attaching the second end of each of the plurality of tethers to one of the anchor points;

determining a fracture condition for each electronic device that breaks the tether at the first end, wherein the fracture condition is same for a group of electronic devices in the plurality of electronic devices;

agitating the wafer, die or other holder at one of the fracture conditions to selectively and in parallel break the tether at the first end of one or more electronic devices; and

separating the one or more electronic devices from the wafer, die or other holder.

13. The method of claim 12, wherein the cell includes a cell frame.

14. The method of claim 13, wherein one or more of the anchor points is on the cell frame.

15. The method of claim 12, wherein the one or more of the anchor point is a proof mass.

16. The method of claim 12, wherein the electronic devices are mesoscale, microscale or nanoscale devices.

17. The method of claim 12, wherein one or more of the electronic devices includes one or more components.

18. The method of claim 17, wherein each component is attached to the cell by one or more tethers.

19. The method of claim 18, wherein one or more of the electronic devices is a safety inertial sensor.

20. The method of claim 12, wherein the fracture conditions comprise agitation frequency, agitation amplitude, and directional agitation angle with respect to tether.

21. A holding device, comprising:

a plurality of electronic devices, wherein each of the electronic devices is encapsulated in a cell;

a plurality of tethers, wherein each tether includes a first end and a second end;

an attachment point on each of the plurality of electronic devices, wherein the first end of each of the plurality of tethers connects to one of the attachment points;

a plurality of anchor points in each cell, wherein the second end of each of the plurality of tethers connects to one of the anchor points; and

wherein fracture conditions for each electronic device break the tether at the first end, wherein the fracture conditions are the same for a group of electronic devices in the plurality of electronic devices.

22. The holding device of claim 21, wherein the holding device is a wafer, die or other holder.

23. The holding device of claim 21, wherein each cell comprises a cell frame.

24. The holding device of claim 23, wherein one or more of the anchor points is on the cell frame.

25. The holding device of claim 21, wherein one or more of the anchor points is a proof mass.

26. The holding device of claim 21, wherein the electronic devices are mesoscale, microscale or nanoscale devices.

27. The holding device of claim 21, wherein one or more of the electronic devices comprises one or more components.

28. The holding device of claim 27, wherein each component is attached to the cell by one or more tethers.

29. The holding device of claim 28, wherein one or more of the electronic devices is a safety inertial sensor.

30. The holding device of claim 21, wherein fracture conditions comprise agitation frequency, agitation amplitude, and directional agitation angle with respect to tether.

31. An article comprising a medium storing instructions that, if executed, enable a processor-based system to:

design a plurality of electronic devices, wherein each of the electronic devices is encapsulated in a cell of a wafer, die or other holder;

design a plurality of tethers, wherein each tether includes a first end and a second end;

select an attachment point on each of the plurality of electronic devices;

attach the first end of each of the plurality of tethers to one of the attachment points;

select a plurality of anchor points;

attach the second end of each of the plurality of tethers to one of the anchor points;

determine a fracture condition for each electronic device that breaks the tether at the first end, wherein the fracture condition is same for a group of electronic devices in the plurality of electronic devices;

agitate the wafer, die or other holder at one of the fracture conditions to selectively and in parallel break the tether at the first end of one or more electronic devices; and

separate the one or more electronic devices from the wafer, die or other holder.