UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES

• US 20100307798A1
• Filed: 06/03/2009
• Published: 12/09/2010
• Est. Priority Date: 06/03/2009
• Status: Abandoned Application

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google LLC (Alphabet Inc.)
• Inventors: Izadian, Jamal S.
• Application Number:
  US12/477,853
• Publication Number:
  US 20100307798A1
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H01L 2224/02379 Fan-out arrangement
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/2405 Shape
• CPC Class Codes: H01L 2224/24101 Connecting bonding areas at the same height
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/48101 Connecting bonding areas at the same height, e.g. horizontal bond
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49173 Radial fan-out arrangements
• CPC Class Codes: H01L 2224/82203 Thermocompression bonding
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01041 : Niobium [Nb]
• CPC Class Codes: H01L 2924/01056 : Barium [Ba]
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 12/523 : by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H05K 1/024 : Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0245 : Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/025 : Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/14 : Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/142 : Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 2201/044 : Details of backplane or midplane for mounting orthogonal PCBs
• CPC Class Codes: H05K 2201/0715 : provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09609 : Via grid, i.e. two-dimensional array of vias or holes in a single plane
• CPC Class Codes: H05K 2201/097 : Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components

Abstract

Traditional High Speed Electronic Systems Interconnect experience several bandwidth bottlenecks along the multiplicity of signal paths that limits the information throughput. Here we build upon the cellular interconnect concept of PMTL, the Periodic Micro Transmission Line which was introduced in an earlier patent application, and provide a new type of transmission line VMPL, as the Vertical Micro Transmission Line approach to make all the elements of a high speed interconnect wideband, unified, scalable, and practical for high volume manufacturing. This provides total connectivity improvements from end-to-end of electronic systems that demands higher bandwidth, and increased information throughput, thermal management, and impeccable signal integrity. The technologies introduced here provide solutions for any level of the fan out from chips to systems, in CMOS, or Packages, and PCB'"'"'s.

Claims

1. A multilayer structure for electromagnetic radiation, wave, or signal transmission line, said structure comprising:

one or more dielectric layers or sections;

one or more conducting layers or sections; and

one or more micro-chambers, sandwiched between one or more of following;

said one or more dielectric layers or sections, said one or more conducting layers or sections, or both said one or more dielectric layers or sections and said one or more conducting layers or sections.

2. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more metals or conductors.

3. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more insulators.

4. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more dielectrics.

5. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more semiconductors.

6. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise fattened or expanded conductor or metal.

7. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise thinned or narrowed dielectric.

8. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more pockets of air.

9. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more pockets of gas.

10. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more pockets of liquid.

11. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more pockets of fluid.

12. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said one or more micro-chambers comprise one or more pockets of vacuum or low pressure gas.

13. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more ground layers.

14. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more transmission layers.

15. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more via holes or through holes.

16. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more plated via holes or through holes.

17. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more not-plated via holes or through holes.

18. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more Vertical Micro-Transmission Lines.

19. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more empty volumes filled with air, gases, or other materials.

20. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more differential pair units.

21. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more quad pair units.

22. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure substantially cancels noise or increases signal-to-noise ratio.

23. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more combinations, arrays, or stacks of units.

24. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more zig-zag configurations or patterns.

25. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more modular units.

26. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure is matched and connected to a second structure.

27. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more 3-dimensional vias.

28. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure comprises one or more Periodic Micro-Transmission Lines.

29. The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1, wherein said structure is a part of a transformer system.