INTEGRATED CIRCUIT LIGHT EMISSION DEVICE, MODULE AND FABRICATION PROCESS
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate having a first surface and a second surface;
a light emission layer having a light emission surface which is not parallel to the first surface or the second surface; and
a first electrode and a second electrode, formed on opposite surfaces of the substrate, to pass current through the light emission layer to cause the light emission layer to emit light.
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Accused Products
Abstract
An integrated circuit device, which can be a light emission device such as a light emitting diode (LED), comprises a substrate, a plurality of device layers formed on a first surface of the substrate, including a first device layer and a second device layer, a first electrode formed on the first device layer, and a second electrode formed on a second surface of the substrate which is parallel and opposite to the first surface of the substrate. A plurality of substantially identical such devices can formed on a semiconductor wafer, where one or both of the first and second electrodes are shared by the plurality of devices prior to dicing the wafer. All of the devices can be tested simultaneously on the wafer, prior to dicing. Formation of the electrodes on opposite sides of the substrate allow the device to be directly connected to a mounting substrate, without any wire bonding.
103 Citations
34 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate having a first surface and a second surface; a light emission layer having a light emission surface which is not parallel to the first surface or the second surface; and a first electrode and a second electrode, formed on opposite surfaces of the substrate, to pass current through the light emission layer to cause the light emission layer to emit light. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device comprising:
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an electrically conductive doped semiconductor substrate having a first surface and a second surface; a quantum well layer which is not parallel to the first surface or the second surface; an electrically conductive reflective layer disposed between the quantum well layer and the second surface; a first electrode and a second electrode, formed on opposite surfaces of the device, to pass current through the quantum well layer to cause the quantum well layer to emit light. - View Dependent Claims (10, 11)
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12. An apparatus comprising:
a plurality of substantially identical light emitting devices formed on a semiconductor substrate, each of the plurality of light emitting devices including a plurality of layers formed on a first surface of the substrate, including a first layer and a plurality of light emitting layers; and a first electrode formed on the first device and shared by all of the plurality of devices. - View Dependent Claims (13, 14, 15, 16)
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17. An apparatus comprising:
a plurality of light emitting diodes formed on a semiconductor substrate, each of the plurality of light emitting diodes including a plurality of device layers formed on a top surface of the substrate; and a first electrode formed on a bottom surface of the substrate and shared by all of the plurality of devices. - View Dependent Claims (18, 19, 20, 21)
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22. A method comprising:
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forming a plurality of light emitting diodes on a semiconductor wafer; prior to dicing of the semiconductor wafer, simultaneously testing all of the plurality of light emitting diodes for manufacturing defects; and dicing the semiconductor wafer to produce a plurality of physically separate light emitting diodes. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A light emission module comprising:
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a mounting substrate which includes a heat sink; a light emitting diode disposed on the mounting substrate; a fastener which attaches the light emitting diode to the mounting substrate, wherein the light emitting diode is electrically connected to contacts on the mounting substrate without any wire bonding. - View Dependent Claims (30, 31, 32, 33, 34)
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Specification