LED Chip-Based Lighting Products And Methods Of Building

• US 20100308350A1
• Filed: 08/16/2010
• Published: 12/09/2010
• Est. Priority Date: 08/26/2008
• Status: Active Grant

• Current Assignee: Jeffrey Bisberg
• Original Assignee: Albeo Technologies (Savant Systems, LLC)
• Inventors: Bisberg, Jeffrey
• Granted Patent: US 8,058,659 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.

Claims

1-16. -16. (canceled)

17. A light emitting diode (LED) chip-based lighting product, comprising:

a panel having a first surface and a second surface counterfacing the first surface, at least part of the second surface forming an external surface of the lighting product;

conductors patterned on the inner surface, and

a plurality of unpackaged LED chips mounted directly to the conductors.

18. The LED chip-based lighting product of claim 0, further comprising power conversion electronics coupled with the conductors.

19. The LED chip-based lighting product of claim 0, wherein the power conversion electronics regulate power for the LED chips.

20. The LED chip-based lighting product of claim 0, further comprising one or more materials applied to one or more of the LED chips.

21. The LED chip-based lighting product of claim 0, wherein the one or more materials include one or more phosphors.

22. The LED chip-based lighting product of claim 0, further comprising electrical connections between top sides of one or more of the LED chips and the conductors.

23. The LED chip-based lighting product of claim 0, wherein the electrical connections includes one or more conductors formed on a cover plate, and light emitted from the one or more LED chips passes through the cover plate.

24. The LED chip-based lighting product of claim 0, wherein the conductors formed on the cover plate are transparent such that light emitted from the LED chips passes through the one or more conductors on the cover plate.

25. The LED chip-based lighting product of claim 0, further comprising one or more reflectors to reflect light from the LED chips.

26. The LED chip-based lighting product of claim 0, further comprising support structure of the lighting product that is mechanically coupled to the panel.

27. The LED chip-based lighting product of claim 0, wherein the panel forms a housing for the lighting product.

28. The LED chip-based lighting product of claim 0, wherein the lighting product forms a direct thermal interface between one or more of the LED chips to ambient air.

29. The LED chip-based lighting product of claim 0, wherein attachment sites for the LED chips on the conductors form a stochastic arrangement such that no lines, grids or other regular patterns are evident in the attachment sites.

30. The LED chip-based lighting product of claim 0, further comprising a diffuser coupled with the support structure such that a distance from the diffuser to the surface of the LED chips is at least twice an average spacing between adjacent ones of the LED chips.

31. A light emitting diode (LED)-based lighting product, comprising:

a panel having a first surface and a second surface counterfacing the first surface, at least part of the second surface forming an external surface of the lighting product;

conductors patterned on the first surface, and

a plurality of LEDs mounted directly to the conductors.

32. The LED-based lighting product of claim 0, further comprising power conversion electronics coupled with the conductors.

33. The LED-based lighting product of claim 0, wherein the lighting product forms a direct thermal interface from one or more of the LEDs to ambient air.

34. The LED-based lighting product of claim 0, further comprising a diffuser coupled with the support structure such that a distance from the diffuser to the surface of the LED chips is at least twice an average spacing between adjacent ones of the LEDs on the panel.