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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

  • US 20100308468A1
  • Filed: 03/02/2009
  • Published: 12/09/2010
  • Est. Priority Date: 03/14/2008
  • Status: Abandoned Application
First Claim
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1. A semiconductor device comprising:

  • a base including at least one external terminal and an element mounting portion;

    a semiconductor element mounted on the element mounting portion;

    a connecting portion electrically connecting the external terminal and the semiconductor element; and

    first resin covering the semiconductor element and the connecting portion, whereinat least part of a boundary line being an end of a boundary plane between the base and the first resin is covered with a covering layer, the part existing on at least one cutting plane along which the base and the first resin are cut.

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