METHOD AND SYSTEM FOR CASCADED LEAKY WAVE ANTENNAS ON AN INTEGRATED CIRCUIT, INTEGRATED CIRCUIT PACKAGE, AND/OR PRINTED CIRCUIT BOARD

• US 20100309073A1
• Filed: 03/31/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/751,593
• Publication Number:
  US 20100309073A1
• Time in Patent Office: Days
• US Class Current: 343/772
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for cascaded leaky wave antennas (LWAs) on an integrated circuit, integrated circuit package, and/or printed circuit board are disclosed and may include communicating RF signals using one or more cascaded LWAs in a wireless device. The cascaded LWAs may include a plurality of cavity heights integrated in metal layers in a multi-layer support structure which may include an integrated circuit, an integrated circuit package, and/or a printed circuit board. The cascaded LWAs may be configured to transmit the wireless signals at a desired angle from the surface of the multi-layer support structure. The cascaded LWAs may include microstrip and/or coplanar waveguides, where the cavity heights of the cascaded LWAs may be dependent on distances between conductive lines in the waveguides. A beam shape of the RF signals may be configured utilizing a frequency of a signal communicated to the cascaded LWAs.

Claims

1. A method for communication, the method comprising:

in a wireless communication device comprising one or more cascaded leaky wave antennas integrated with a multi-layer support structure;

communicating RF signals via said one or more cascaded leaky wave antennas, wherein cavity heights within metal layers of said multi-layer support structure control a resonant frequency of said one or more cascaded leaky wave antennas.

2. The method according to claim 1, wherein said multi-layer support structure comprises an integrated circuit.

3. The method according to claim 1, wherein said multi-layer support structure comprises an integrated circuit package.

4. The method according to claim 1, wherein said multi-layer support structure comprises a printed circuit board.

5. The method according to claim 1, comprising configuring said one or more cascaded leaky wave antennas to transmit said RF signals at a desired angle from a surface of said multi-layer support structure.

6. The method according to claim 1, wherein said one or more cascaded leaky wave antennas comprise microstrip waveguides.

7. The method according to claim 6, comprising controlling said plurality of cavity heights of said one or more cascaded leaky wave antennas based on distances between conductive lines in said microstrip waveguides.

8. The method according to claim 1, wherein said one or more cascaded leaky wave antennas comprise coplanar waveguides.

9. The method according to claim 8, comprising controlling said plurality of cavity heights of said one or more cascaded leaky wave antennas based on distances between conductive lines in said coplanar waveguides.

10. The method according to claim 1, comprising configuring a beam shape of said communicated RF signals utilizing a frequency of a signal communicated to said one or more cascaded leaky wave antennas.

11. A system for enabling communication, the system comprising:

one or more circuits for use in a wireless device comprising one or more cascaded leaky wave antennas integrated with a multi-layer support structure, said one or more circuits being operable to communicate RF signals via said one or more cascaded leaky wave antennas, wherein cavity heights integrated within metal layers of said multi-layer support structure control a resonant frequency of said one or more cascaded leaky wave antennas.

12. The system according to claim 11, wherein said multi-layer support structure comprises an integrated circuit.

13. The system according to claim 11, wherein said multi-layer support structure comprises an integrated circuit package.

14. The system according to claim 11, wherein said multi-layer support structure comprises a printed circuit board.

15. The system according to claim 11, wherein said one or more circuits are operable to configure said cascaded leaky wave antennas to transmit said RF signals at a desired angle from a surface of said multi-layer support structure.

16. The system according to claim 11, wherein said one or more cascaded leaky wave antennas comprise microstrip waveguides.

17. The system according to claim 16, wherein said one or more circuits are operable to control said plurality of cavity heights of said one or more cascaded leaky wave antennas based on distances between conductive lines in said microstrip waveguides.

18. The system according to claim 11, wherein said one or more leaky wave antennas comprise coplanar waveguides.

19. The system according to claim 18, wherein said one or more circuits is operable to control said plurality of cavity heights of said one or more cascaded leaky wave antennas based on distances between conductive lines in said coplanar waveguides.

20. The system according to claim 19, wherein said one or more circuits are operable to configure a beam shape of said communicated RF signals utilizing a frequency of a signal communicated to said one or more cascaded leaky wave antennas.