METHOD AND SYSTEM FOR A LEAKY WAVE ANTENNA ON AN INTEGRATED CIRCUIT PACKAGE

• US 20100309074A1
• Filed: 03/31/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/751,751
• Publication Number:
  US 20100309074A1
• Time in Patent Office: Days
• US Class Current: 343/772
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for a leaky wave antenna LWA on an integrated circuit (IC) package are disclosed and may include communicating RF signals using one or more LWAs in a wireless device. The LWAs may be integrated in metal layers in an IC package, and a resonant frequency of the LWAs may be dependent on cavity heights associated with the metal layers. The cavity heights may be configured utilizing micro-electro-mechanical systems deflection. The RF signals may include 60 GHz signals. The LWAs may include microstrip and/or coplanar waveguides where a cavity height of the LWAs may be dependent on a spacing between conductive lines in the waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the IC package. The IC package may be affixed to a printed circuit board, and an IC may be flip-chip-bonded to the IC package.

Claims

1. A method for communication, the method comprising:

communicating RF signals using one or more leaky wave antennas in a wireless device, wherein;

said one or more leaky wave antennas are integrated in metal layers in an integrated circuit package; and

a resonant frequency of said one or more leaky wave antennas is dependent on one or more cavity heights that is associated with said metal layers.

2. The method according to claim 1, comprising configuring at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1, comprising configuring at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.

4. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said integrated circuit package.

9. The method according to claim 1, wherein said integrated circuit package is affixed to a printed circuit board.

10. The method according to claim 1, wherein an integrated circuit is flip-chip-bonded to said integrated circuit package.

11. A system for enabling communication, the system comprising:

an integrated circuit package for use in a wireless device, said integrated circuit package comprising one or more leaky wave antennas, wherein;

said one or more leaky wave antennas are integrated in metal layers in an integrated circuit package; and

a resonant frequency of said one or more leaky wave antennas is dependent on one or more cavity heights that is associated with said metal layers.

12. The system according to claim 11, wherein said wireless device is operable to configure at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11, wherein said wireless device is operable to configure at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.

14. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said wireless device is operable to configure said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said integrated circuit package.

19. The system according to claim 11, wherein said integrated circuit package is affixed to a printed circuit board.

20. The system according to claim 11, wherein an integrated circuit is flip-chip-bonded to said integrated circuit package.