METHOD AND SYSTEM FOR COMMUNICATING VIA LEAKY WAVE ANTENNAS ON HIGH RESISTIVITY SUBSTRATES
First Claim
1. A method for communication, the method comprising:
- in a wireless device comprising one or more leaky wave antennas, communicating RF signals via said one or more leaky wave antennas, wherein one or more of said leaky wave antennas are integrated in an integrated circuit comprising a high resistivity substrate.
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Abstract
Methods and systems for communicating via leaky wave antennas (LWAs) on high resistivity substrates are disclosed and may include communicating RF signals using one or more LWAs that may be integrated in an integrated circuit (chip) comprising a high resistivity substrate, which may include a silicon-on-sapphire substrate. The LWAs integrated in the chip may be configured to transmit the RF signals at a desired angle from the surface of the chip. The RF signals may be communicated between regions within the chip. The LWAs may include microstrip or coplanar waveguides where the cavity height of the one or more of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The RF signals may be communicated from the LWAs integrated in the chip to LWAs in a package to which the chip is bonded or in a printed circuit board to which the package is bonded.
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Citations
20 Claims
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1. A method for communication, the method comprising:
in a wireless device comprising one or more leaky wave antennas, communicating RF signals via said one or more leaky wave antennas, wherein one or more of said leaky wave antennas are integrated in an integrated circuit comprising a high resistivity substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for enabling communication, the system comprising:
one or more circuits for use in a wireless device comprising one or more leaky wave antennas, said one or more circuits are operable to communicate RF signals via said one or more leaky wave antennas, wherein one or more of said leaky wave antennas are integrated in an integrated circuit comprising a high resistivity substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
Specification