METHOD AND SYSTEM FOR WIRELESS COMMUNICATION UTILIZING LEAKY WAVE ANTENNAS ON A PRINTED CIRCUIT BOARD

• US 20100309077A1
• Filed: 03/31/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/751,772
• Publication Number:
  US 20100309077A1
• Time in Patent Office: Days
• US Class Current: 343/776
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for wireless communication utilizing leaky wave antennas (LWAs) on a printed circuit board are disclosed and may include communicating RF signals via LWAs in an integrated circuit (chip) and/or package in a wireless device to LWAs in a printed circuit board in the wireless device. RF signals may then be communicated via the LWAs in the printed circuit board to external devices, and may communicated vertically or at a desired angle from the surface. The RF signals may be communicated between regions within the printed circuit board. The LWAs may include microstrip or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The chip may be flip-chip-bonded to an package which may be affixed to a printed circuit board. A pair of the plurality of LWAs may be stacked to communicate signals in opposite directions.

Claims

1. A method for communication, the method comprising:

in a wireless device comprising a plurality of leaky wave antennas, wherein one or more of said plurality of leaky wave antennas are integrated in an integrated circuit and one or more of said plurality of leaky wave antennas are integrated in a printed circuit board;

communicating RF signals from said one or more of said plurality of leaky wave antennas integrated in said integrated circuit to said one or more of said plurality of leaky wave antennas integrated in said printed circuit board; and

communicating said RF signals from said one or more of said plurality of leaky wave antennas integrated in said printed circuit board to devices external to said wireless device.

2. The method according to claim 1, comprising communicating said RF signals to devices external to said wireless device via a surface of said printed circuit board.

3. The method according to claim 2, comprising configuring said one or more of said plurality of leaky wave antennas integrated in said printed circuit board to transmit said wireless signals at a desired angle from said surface of said printed circuit board.

4. The method according to claim 1, comprising communicating said RF signals between regions within said printed circuit board.

5. The method according to claim 1, wherein one or more of said plurality of leaky wave antennas comprise microstrip waveguides.

6. The method according to claim 5, comprising configuring a cavity height of said one or more of said plurality of leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.

7. The method according to claim 1, wherein one or more of said plurality of leaky wave antennas comprise coplanar waveguides.

8. The method according to claim 7, comprising configuring a cavity height of said one or more of said plurality of leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.

9. The method according to claim 1, comprising communicating said RF signals from said one or more of said plurality of leaky wave antennas integrated in said integrated circuit to one or more leaky wave antennas in an integrated circuit package to which said integrated circuit is flip-chip bonded before communicating said RF signals to said one or more of said plurality of leaky wave antennas integrated in said printed circuit board.

10. The method according to claim 1, wherein a pair plurality of leaky wave antennas are stacked to communicate wireless signals in opposite directions.

11. A system for enabling communication, the system comprising:

one or more circuits for use in a wireless device comprising a plurality of leaky wave antennas, wherein one or more of said plurality of leaky wave antennas are integrated in an integrated circuit and one or more of said plurality of leaky wave antennas are integrated in a printed circuit board;

said one or more circuits are operable to communicate RF signals from said one or more of said plurality of leaky wave antennas integrated in said integrated circuit to said one or more of said plurality of leaky wave antennas integrated in said printed circuit board; and

said one or more circuits are operable to communicate said RF signals from said one or more of said plurality of leaky wave antennas integrated in said printed circuit board to devices external to said wireless device.

12. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals to devices external to said wireless device via a surface of said printed circuit board.

13. The system according to claim 12, wherein said one or more circuits are operable to configure said one or more of said plurality of leaky wave antennas integrated in said printed circuit board to transmit said wireless signals at a desired angle from said surface of said printed circuit board.

14. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals between regions within said printed circuit board.

15. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

16. The system according to claim 15, wherein said one or more circuits are operable to configure a cavity height of said one or more of said plurality of leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.

17. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

18. The system according to claim 17, wherein said one or more circuits are operable to configure a cavity height of said one or more of said plurality of leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.

19. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals from said one or more of said plurality of leaky wave antennas integrated in said integrated circuit to one or more leaky wave antennas in an integrated circuit package to which said integrated circuit is flip-chip bonded before communicating said RF signals to said one or more of said plurality of leaky wave antennas integrated in said printed circuit board.

20. The system according to claim 11, wherein a pair plurality of leaky wave antennas are stacked to communicate wireless signals in opposite directions.