SURFACE MOUNT ELECTRONIC DEVICE PACKAGING ASSEMBLY

• US 20100309640A1
• Filed: 06/01/2010
• Published: 12/09/2010
• Est. Priority Date: 06/01/2009
• Status: Active Grant

• Current Assignee: Electro Ceramic Industries
• Original Assignee: Electro Ceramic Industries
• Inventors: Schlomann, Herbert W.
• Granted Patent: US 8,358,003 B2
• Time in Patent Office: Days
• US Class Current: 361/767
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A surface mount electronic device packaging assembly includes a body having an aperture defined therethrough. The aperture is adapted to receive an electronic device therein. The body has a first surface and a second surface. An electrically conductive contact pad is disposed on the first surface of the body. The contact pad is adapted to receive a lead from the electronic device. A thermally conductive base pad is disposed on the second surface of the body. A top surface of the base pad is adapted to receive the electronic device thereon.

Claims

1. An electronic device packaging assembly comprising:

a body having a first surface and a second surface, the body having at least one aperture defined therethrough;

at least one electrically conductive contact pad disposed on the first surface of the body; and

at least one base pad disposed on the second surface of the body,

wherein the at least one aperture is adapted to receive at least a portion of an electronic device, the electronic device in at least thermal conductive contact with the at least one base pad.

2. The assembly of claim 1, wherein the at least one aperture comprises a first and a second aperture.

3. The assembly of claim 2, wherein the first aperture is adapted to receive at least a portion of a first electronic device, and the second aperture is adapted to receive at least a portion of a second electronic device.

4. The assembly of claim 3, wherein the at least one contact pad comprises a first and second contact pad.

5. The assembly of claim 4, wherein the first and second contact pads are in conductive contact with the first and second electronic devices.

6. The assembly of claim 2, wherein the first aperture is adapted to receive at least a portion of an electronic device, and the second aperture is arranged in contact with the at least one contact pad.

7. The assembly of claim 6, wherein the second aperture is metalized and in electrically conductive contact with the at least one contact pad.

8. The assembly of claim 2, wherein the at least one base pad comprises a first and second base pad.

9. The assembly of claim 8, wherein the first and second base pads are separated by an insulating portion.

10. The assembly of claim 1, wherein said contact pad is adapted to receive a lead from the electronic device.

11. The assembly of claim 1, wherein the electronic device is completely disposed within the at least one aperture.

12. The assembly of claim 1, wherein the at least one base pad is further disposed on a circuit board.

13. The assembly of claim 1, further comprising a frame disposed around a perimeter of the body, wherein the frame is configured to receive a cover, the frame and the cover arranged to hermetically seal the at least one aperture and electronic device from an external environment.

14. The assembly of claim 1, wherein the body comprises a ceramic material.

15. The assembly of claim 1, wherein the electric device is disposed on a top surface of the base pad within the at least one aperture in the body.

16. The assembly of claim 1, wherein the at least one base pad comprises at least one metal base pad.

17. A method of packaging an electronic device, the method comprising the steps of:

forming at least one aperture through a body;

forming a contact pad on a top surface of the body;

forming a base pad on a bottom surface of the body;

mounting an electronic device on the base pad and within the at least one aperture, and

electrically coupling the electronic device to the contact pad.

18. The method of claim 17, wherein the step of forming a contact pad on the top surface of the body comprises applying a conductive coating to a surface of the body.

19. The method of claim 17, wherein the step of forming the base pad on the bottom surface of the body comprises brazing a metallic base pad on the bottom surface of the body.

20. The method of claim 17, further comprising the step of hermetically sealing the at least one aperture and the electronic device from an outside environment.