METHOD AND SYSTEM FOR A DUPLEXING LEAKY WAVE ANTENNA

• US 20100309824A1
• Filed: 06/09/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/796,975
• Publication Number:
  US 20100309824A1
• Time in Patent Office: Days
• US Class Current: 370/277
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for a duplexing leaky wave antenna (LWA) are disclosed. In this regard, RF signals may be concurrently transmitted and received via a leaky wave antenna, wherein a height of a first portion of a resonant cavity of the leaky wave antenna is different than a height of a second portion of the resonant cavity. RF signals transmitted may be at or near a first frequency and RF signals received be at or near a second frequency. The height of the first portion of the resonant cavity and/or the height of the second portion of the resonant cavity may be controlled by applying one or more voltages which causes one or both reflective surface of the leaky wave antenna to deflect. The leaky wave antenna may be integrated on and/or within an integrated circuit, an integrated circuit package, a printed circuit board, or a combination thereof.

Claims

1. A method for communication, the method comprising:

concurrently transmitting and receiving RF signals via a leaky wave antenna, wherein a height of a first portion of a resonant cavity of said leaky wave antenna is different than a height of a second portion of said resonant cavity of said leaky wave antenna.

2. The method according to claim 1, comprising transmitting RF signals at a first frequency via said leaky wave antenna and receiving RF signals at a second frequency via said leaky wave antenna.

3. The method according to claim 1, comprising receiving RF signal via a feed point in said first portion of said resonant cavity

4. The method according to claim 3, comprising transmitting RF signal via a feed point in said second portion of said resonant cavity

5. The method according to claim 1, comprising communicating said RF signals between regions within an integrated circuit.

6. The method according to claim 1, comprising controlling said height of said first portion of said resonant cavity and/or said height of said second portion of said resonant cavity by applying one or more voltages which causes one or both reflective surface of said leaky wave antenna to deflect.

7. The method according to claim 6, comprising controlling said height of said first portion of said resonant cavity and said height of said second portion of said resonant cavity in unison via a single voltage.

8. The method according to claim 6, comprising controlling said height of said first portion of said resonant cavity via a first voltage and controlling said height of said second portion of said resonant cavity via a second voltage.

9. The method according to claim 1, wherein said leaky wave antenna is integrated on chip.

10. The method according to claim 1, wherein said leaky wave antenna on and/or within an integrated circuit package.

11. A system for communication, the system comprising:

one or more circuits and/or processors comprising a leaky wave antenna, wherein said one or more circuits are operable to;

concurrently transmit and receive RF signals via said leaky wave antenna, wherein a height of a first portion of a resonant cavity of said leaky wave antenna is different than a height of a second portion of said resonant cavity of said leaky wave antenna.

12. The system according to claim 11, wherein said one or more circuits and/or processors are operable to transmit RF signals at a first frequency via said leaky wave antenna and receive RF signals at a second frequency via said leaky wave antenna.

13. The system according to claim 11, wherein said one or more circuits and/or processors are operable to receive RF signal via a feed point in said first portion of said resonant cavity

14. The system according to claim 13, wherein said one or more circuits and/or processors are operable to transmit RF signal via a feed point in said second portion of said resonant cavity.

15. The system according to claim 11, comprising communicating said RF signals between regions within an integrated circuit.

16. The system according to claim 11, wherein said one or more circuits and/or processors are operable to control said height of said first portion of said resonant cavity and/or said height of said second portion of said resonant cavity by applying one or more voltages which causes one or both reflective surfaces of said leaky wave antenna to deflect.

17. The system according to claim 16, wherein said one or more circuits and/or processors are operable to control said height of said first portion of said resonant cavity and said height of said second portion of said resonant cavity in unison via a single voltage.

18. The system according to claim 16, wherein said one or more circuits and/or processors are operable to controlling said height of said first portion of said resonant cavity via a first voltage and controlling said height of said second portion of said resonant cavity via a second voltage.

19. The system according to claim 11, wherein said one or more circuits comprising said leaky wave antenna is integrated on a chip.

20. The system according to claim 11, wherein said leaky wave antenna on and/or within an integrated circuit package.