POWER MODE CONTROL FOR A COMMUNICATION DEVICE AND METHOD FOR USE THERWITH

• US 20100310064A1
• Filed: 07/29/2010
• Published: 12/09/2010
• Est. Priority Date: 02/08/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza (Reza)
• Granted Patent: US 8,010,078 B2
• Time in Patent Office: Days
• US Class Current: 379/395.01
• CPC Class Codes: G06F 1/3203 Power management, i.e. event-based initiation of a power-saving mode
• CPC Class Codes: G06F 1/3296 by lowering the supply or operating voltage
• CPC Class Codes: H04M 1/72409 by interfacing with external accessories hands-free H04M1/60
• CPC Class Codes: H04M 1/72412 using two-way short-range wireless interfaces
• CPC Class Codes: H04W 52/0235 where the received signal is a power saving command
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management
• CPC Class Codes: Y02D 30/70 in wireless communication networks

Abstract

A power status signal is received in an integrated circuit that indicates an inductive power status of an off-chip inductive power module and a battery power status of a battery. A power mode is selected based on the at least one power status signal. A power mode signal is generated based on the selected power mode. A power supply signal is generated and adjusted in response to the power mode signal.

Claims

1. A communication device comprising:

voice data and RF integrated circuit (IC) that generates a power mode signal based on a selected one of a plurality of power modes, the voice data and RFIC including a RF transceiver circuit and a baseband processing circuit;

an off-chip inductive power circuit that generates an inductive power signal;

an off-chip power management circuit, coupled to the voice data and RF IC and the off-chip inductive power circuit and at least one alternative power source, wherein the off-chip power management circuit;

receives the power mode signal;

generates a power supply signal from one of, the inductive power signal and the at least one alternative power source; and

adjusts the power supply signal in response to the power mode signal.

2. The communication device of claim 1 further comprising:

a signal interface between the off-chip power management circuit and the voice data and RFIC that operates in accordance with one of;

serialization deserialization (SERDES) signaling; and

inter IC (I²C) signaling.

3. The communication device of claim 1 further comprising a wired communication interface.

4. The communication device of claim 1 wherein the communication device is one of:

a personal digital assistant, a portable computer and a game console.

5. The communication device of claim 1 wherein the voice data and RFIC communicates in accordance with one of:

an 802.11 signaling protocol;

a Bluetooth signaling protocol;

a WIMAX protocol;

a Global System for Mobile Communications (GSM) protocol;

a General Packet Radio Service (GPRS) protocol;

a Enhanced Data Rates for Global Evolution (EDGE) protocol; and

a Personal Communication Services (PCS) protocol.

6. The communication device of claim 1 wherein the RFIC includes an interface circuit that at operates as at least one of:

a camera interface;

a keyboard interface;

a display interface, and an antenna interface.

7. The communication device of claim 6 wherein the interface circuit can be selectively deactivated and wherein the voice data and RF IC generates the power mode signal that commands the off-chip power management circuit to discontinue powering of the interface circuit.

8. The communication device of claim 6 wherein the interface circuit interfaces the voice data RF IC to a peripheral device that is powered via the interface circuit.

9. The communication device of claim 1 wherein the voice data and RF IC is configured in a flip chip package.

10. A voice data and RF integrated circuit (IC) comprising:

a processing circuit that executes a plurality of operational instructions of at least one application and that determines a selected one of the plurality of power modes, and generates a power mode signal based on the selected one of the plurality of power modes; and

an on-chip power management circuit, coupled to the processing circuit, an off-chip inductive power circuit and coupleable to at least one alternative power source, that receives the power mode signal and that generates a power supply signal, based on the power mode signal, from one of, a inductive power signal from the off-chip inductive power circuit, and an alternative power signal from the at least one alternative power source;

wherein an interface circuit can be selectively deactivated by the processing circuit and wherein the processing circuit generates the power mode signal that commands the on-chip power management circuit to discontinue the generation of a supply voltage to power the interface circuit.

11. The voice data and RF IC of claim 10 further comprising:

a memory circuit, coupled to the processing circuit, that stores the plurality of power modes.

12. The voice data and RF IC of claim 10 further comprising:

an RF transceiver circuit for communicating with at least one remote device via RF signaling.

13. The voice data and RF IC of claim 10 wherein the RF transceiver circuit for communicates with at least one remote device in accordance with one of:

an 802.11 signaling protocol;

a Bluetooth signaling protocol; and

a WIMAX protocol.

14. The voice data and RF IC of claim 10 further comprising a wired communication interface.

15. The voice data and RF IC of claim 10 wherein the RFIC includes an interface circuit that at operates as at least one of:

a camera interface;

a keyboard interface;

a display interface, and an antenna interface.

18. The voice data and RF IC of claim 10 further comprising:

a package substrate; and

a plurality of dies configured in a flip chip package.

19. The voice data and RF IC of claim 18 wherein the on-chip power management circuit is implemented on one of the plurality of dies that is positioned on the bottom of the package substrate.

20. The voice data and RF IC of claim 18 wherein the on-chip power management circuit is implemented on one of the plurality of dies that is positioned on the bottom of the package substrate to provide heat dissipation to an external circuit board.

16. The voice data and RF IC of claim 16 wherein the interface circuit can be selectively deactivated and wherein the voice data and RF IC generates the power mode signal that commands the off-chip power management circuit to discontinue powering of the interface circuit.

17. The voice data and RF IC of claim 16 wherein the interface circuit interfaces the voice data RF IC to a peripheral device that is powered via the interface circuit.