Implantable Medical Device Having a Conformal Coating and Method for Manufacture

• US 20100310756A1
• Filed: 08/20/2010
• Published: 12/09/2010
• Est. Priority Date: 06/29/2006
• Status: Abandoned Application

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Yang, Zhongping, McVenes, Rick D.
• Application Number:
  US12/860,059
• Publication Number:
  US 20100310756A1
• Time in Patent Office: Days
• US Class Current: 427/2.24
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0558 Anchoring or fixation means therefor
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: C23C 16/45555 applied in non-semiconductor technology

Abstract

An implantable electrical medical device and method for manufacturing the same are provided. The method includes forming a conductive substrate, placing the conductive substrate in a deposition chamber; and forming a conformal coating over the conductive substrate using atomic layer deposition. In various embodiments, the conformal coating is a conductive coating and in other embodiments the conformal coating is a dielectric coating.

Claims

1. A method for manufacturing an implantable electrical medical device, comprising:

forming a conductive substrate;

placing the substrate in a deposition chamber; and

forming a first conformal coating over at least a portion of the substrate using atomic layer deposition.

2. The method of claim 1 wherein the conductive substrate comprises an electrode base.

3. The method of claim 1 wherein the conductive substrate comprises a housing of the medical device.

4. The method of claim 2 wherein forming the substrate comprises forming a surface area enhanced electrode base.

5. The method of claim 2 further comprising assembling the electrode base along one of an elongated lead body and a housing of the implantable medical device.

6. The method of claim 1 wherein the substrate comprises one of tungsten, a tungsten alloy, stainless steel, and a stainless steel alloy.

7. The method of claim 1 wherein the first conformal coating is a conductive coating being more chemically stable than the substrate and comprising one of:

a carbide, a carbonitride, and a nitride.

8. The method of claim 1 further comprising forming a high surface area, low-polarization coating over the conformal coating.

9. The method of claim 1 wherein the conformal coating is a dielectric coating comprising a metal oxide.

10. The method of claim 9 wherein the conductive substrate is an electrode base and further comprising electrically coupling the electrode base to a conductor, the conductor being electrically coupled to a second electrode used for one of sensing electrical body signals and delivering electrical stimulation pulses.

11. The method of claim 9 further comprising forming a second conformal coating over a second portion of the conductive substrate using atomic layer deposition, the second conformal coating being a conductive coating.

12. The method of claim 1 wherein forming the conformal coating comprises forming a patterned coating, wherein forming the patterned coating comprises one of selective deposition of the conformal coating and selective decomposing of the conformal coating.