VACUUM PROCESSING APPARATUS AND OPERATING METHOD FOR VACUUM PROCESSING APPARATUS
First Claim
1. A vacuum processing apparatus that carries out a self-cleaning procedure by feeding a cleaning gas into a film deposition chamber in which film deposition processing is carried out on a substrate, wherein a timing interval between self-cleaning procedures is set in a range in which a film deposition operating time ratio is converged with respect to an increase in the film deposition processing amount, where the film deposition operating time ratio represented by a proportion of a film deposition-related operating time in the sum of the film deposition-related operating time, which includes a film deposition time and a film deposition preparation time, and a cleaning-related operating time, which includes a self-cleaning procedure time, a self-cleaning procedure preparation time, and a pre-deposition film deposition time.
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Accused Products
Abstract
It is an object of the invention to provide a vacuum processing apparatus that enables setting a timing interval between self-cleaning procedures simply and so as to have general-use, enables significantly lengthening this timing interval, and improves the production efficiency. In a plasma CVD apparatus (100) that carries out self-cleaning procedure by feeding a cleaning gas into a film deposition chamber (1) in which film deposition processing is carried out on a substrate (4), the timing interval between self-cleaning procedures is set in a range in which a film deposition operating time ratio (Ps) is converged with respect to an increase in a film deposition process amount, where the film deposition operating time ratio (Ps) is represented by the proportion of a film deposition-related operating time (Tt) in the sum of the film deposition-related operating time (Tt) and a cleaning-related operating time (Tc).
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Citations
14 Claims
- 1. A vacuum processing apparatus that carries out a self-cleaning procedure by feeding a cleaning gas into a film deposition chamber in which film deposition processing is carried out on a substrate, wherein a timing interval between self-cleaning procedures is set in a range in which a film deposition operating time ratio is converged with respect to an increase in the film deposition processing amount, where the film deposition operating time ratio represented by a proportion of a film deposition-related operating time in the sum of the film deposition-related operating time, which includes a film deposition time and a film deposition preparation time, and a cleaning-related operating time, which includes a self-cleaning procedure time, a self-cleaning procedure preparation time, and a pre-deposition film deposition time.
- 9. An operating method for a vacuum processing apparatus that carries out a self-cleaning procedure by feeding a cleaning gas into a film deposition chamber in which a film deposition processing is carried out on a substrate, comprising the step of implementing the self-cleaning procedure in a range in which a film deposition operating time ratio is converged with respect to an increase in a film deposition processing amount, where the film deposition operating time ratio is represented by the proportion of a film deposition-related operating time in the sum of the film deposition-related operating time, which includes a film deposition time and a film deposition preparation time, and a cleaning-related operating time, which includes a self-cleaning procedure time, a self-cleaning procedure preparation time, and an pre-deposition film deposition time.
Specification