METHOD AND SYSTEM FOR CONTROLLING POWER FOR A POWER AMPLIFIER UTILIZING A LEAKY WAVE ANTENNA

• US 20100311364A1
• Filed: 06/09/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Granted Patent: US 8,995,937 B2
• Time in Patent Office: Days
• US Class Current: 455/127.1
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for controlling power for a power amplifier utilizing a leaky wave antenna (LWA) are disclosed and may include configuring one or more power amplifiers (PAs) in a wireless device at a desired output power level. The PAs may be coupled to feed points on the LWAs that may exhibit an input impedance corresponding to an output impedance of the PAs. RF signals may be transmitted utilizing the LWAs. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to transmit the RF signals in a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The input impedances of the feed points may be dependent on a position of the feed points in the cavities.

Claims

1. A method for communication, the method comprising:

configuring one or more power amplifiers in a wireless device to operate at a desired output power level;

coupling said configured one or more power amplifiers to one or more feed points on one or more leaky wave antennas, wherein said one or more coupled feed points exhibits an input impedance corresponding to an output impedance of said configured one or more power amplifiers; and

transmitting wireless RF signals utilizing said one or more leaky wave antennas via said one or more coupled feed points.

2. The method according to claim 1, comprising configuring a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1, comprising configuring said one or more leaky wave antennas to transmit said RF signals in a desired direction.

4. The method according to claim 1, wherein said one or more leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein a cavity height of said one or more leaky wave antennas is dependent on spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said one or more leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein a cavity height of said one or more leaky wave antennas is dependent on spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, wherein said input impedances of said feed points is dependent on a position of said feed points in said one or more leaky wave antennas.

9. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more of:

an integrated circuit, an integrated circuit package, and/or a printed circuit board.

10. The method according to claim 9, wherein said one or more integrated circuits is flip-chip-bonded to said one or more integrated circuit packages that are coupled to said printed circuit board.

11. A system for enabling communication, the system comprising:

one or more circuits for use in a wireless device comprising one or more leaky wave antennas, said one or more circuits comprising one or more power amplifiers, wherein said one or more circuits are operable to;

configure one or more power amplifiers in said wireless device at a desired output power level;

couple said configured one or more power amplifiers to one or more feed points on said one or more leaky wave antennas, wherein said one or more coupled feed points exhibits an input impedance corresponding to an output impedance of said configured one or more power amplifiers; and

transmit wireless RF signals utilizing said one or more leaky wave antennas via said one or more coupled feed points.

12. The system according to claim 11, wherein said one or more circuits are operable to configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11, wherein said one or more circuits are operable to configure said one or more leaky wave antennas to transmit said RF signals in a desired direction.

14. The system according to claim 11, wherein said one or more leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein a cavity height of said one or more leaky wave antennas is dependent on spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said one or more leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein a cavity height of said one or more leaky wave antennas is dependent on spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said input impedances of said feed points is dependent on a position of said feed points in said one or more leaky wave antennas.

19. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more of:

an integrated circuit, an integrated circuit package, and/or a printed circuit board.

20. The system according to claim 19, wherein said one or more integrated circuits is flip-chip-bonded to said one or more integrated circuit packages that are coupled to said printed circuit board.