METHOD AND SYSTEM FOR AN INTEGRATED VOLTAGE CONTROLLED OSCILLATOR-BASED TRANSMITTER AND ON-CHIP POWER DISTRIBUTION NETWORK

• US 20100311472A1
• Filed: 12/30/2009
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Granted Patent: US 8,447,250 B2
• Time in Patent Office: Days
• US Class Current: 455/572
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for an integrated voltage controlled oscillator (VCO)-based transmitter and on-chip power distribution network are disclosed and may include supplying bias voltages and/or ground to a chip utilizing conductive lines. One or more VCOs and low-noise amplifiers (LNAs) may each be coupled to a leaky wave antenna (LWA) integrated in the bias voltage and/or ground lines. One or more clock signals may be generated utilizing the VCOs, which may be transmitted from the LWAs coupled to the VCOs, to the LWAs coupled to the LNAs. RF signals may be transmitted via the LWAs, and may include 60 GHz signals. The LWAs may include microstrip and/or coplanar waveguides, where a cavity length of the LWAs may be dependent on a spacing between conductive lines in the waveguides. The LWAs may be dynamically configured to transmit the clock signals at a desired angle from a surface of the chip.

Claims

1. A method for communication, the method comprising:

performing using one or more or more circuits in a wireless device, said one or more circuits comprising one or more voltage-controlled oscillators and one or more low-noise amplifiers on a chip, wherein each of said one or more voltage-controlled oscillators and said one or more low-noise amplifiers is communicatively coupled to a leaky wave antenna integrated in bias voltage and/or ground lines to said chip;

supplying one or more bias voltages and/or ground for said chip utilizing said bias voltage and/or ground lines, respectively;

generating one or more clock signals utilizing said one or more voltage-controlled oscillators; and

transmitting said generated clock signals via said leaky wave antennas communicatively coupled to said one or more voltage-controlled oscillators to said one or more leaky wave antennas communicatively coupled to said one or more low-noise amplifiers.

2. The method according to claim 1, comprising transmitting radio frequency (RF) signals via said one or more leaky wave antennas.

3. The method according to claim 2, wherein said RF signals comprise 60 GHz signals.

4. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, comprising configuring said leaky wave antennas to transmit said one or more generated clock signals at a desired angle from a surface of said chip.

9. The method according to claim 8, comprising dynamically configuring said angle from said surface of said chip.

10. The method according to claim 1, comprising configuring a gain of said one or more low-noise amplifiers for receiving said transmitted clock signals.

11. A system for enabling communication, the system comprising:

one or more or more circuits in a wireless device, said one or more circuits comprising one or more voltage-controlled oscillators and one or more low-noise amplifiers on a chip, wherein each said one or more voltage-controlled oscillators and said one or more low-noise amplifiers is communicatively coupled to a leaky wave antenna integrated in bias voltage and/or ground lines to said chip, said one or more circuits being operable to;

supply one or more bias voltages and ground for said chip utilizing said bias voltage and/or ground lines, respectively;

generate one or more clock signals utilizing said one or more voltage-controlled oscillators; and

transmit said generated clock signals via said leaky wave antennas communicatively coupled to said one or more voltage-controlled oscillators to said one or more leaky wave antennas communicatively coupled to said one or more low-noise amplifiers.

12. The system according to claim 11, wherein said one or more circuits are operable to transmit radio frequency (RF) signals via said one or more leaky wave antennas.

13. The system according to claim 12, wherein said one or more circuits are operable to wherein said RF signals comprise 60 GHz signals.

14. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said one or more circuits are operable to configure said leaky wave antennas to transmit said one or more generated clock signals at a desired angle from a surface of said chip

19. The system according to claim 18, wherein said one or more circuits are operable to dynamically configure said angle from said surface of said chip.

20. The system according to claim 11, wherein a gain of said one or more low-noise amplifiers is configured for receiving said transmitted clock signals.