INTEGRATED MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) SENSOR DEVICE

• US 20100312468A1
• Filed: 06/03/2009
• Published: 12/09/2010
• Est. Priority Date: 06/03/2009
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Withanawasam, Lakshman
• Granted Patent: US 8,315,793 B2
• Time in Patent Office: Days
• US Class Current: 701/207
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence

Abstract

An integrated sensor device is provided. The integrated sensor device comprises a first substrate including a surface portion and a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate. The integrated sensor device also comprises one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity. The integrated sensor device further comprises one or more additional sensors.

Claims

1. An integrated sensor device, comprising:

a first substrate including a surface portion;

a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate;

one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity; and

one or more additional sensors.

2. The sensor device of claim 1, wherein the first substrate and the second substrate comprise silicon, glass, or quartz.

3. The sensor device of claim 1, wherein the cavity contains a vacuum or an inert gas.

4. The sensor device of claim 1, wherein the one or more MEMS sensors comprise an accelerometer, a gyroscope, a flow sensor, a gas detector, or combinations thereof.

5. The sensor device of claim 1, wherein the one or more additional sensors comprise a magnetic sensor, a pressure sensor, or combinations thereof.

6. The sensor device of claim 1, wherein:

the one or more MEMS sensors is configured to provide acceleration data; and

the one or more additional sensors is at least one magnetic sensor configured to provide directional data.

7. The sensor device of claim 1, wherein the one or more MEMS sensors and the one or more additional sensors are electrically isolated from each other.

8. The sensor device of claim 1, wherein the one or more additional sensors are located in the first substrate, the second substrate, or combinations thereof.

9. A method of forming an integrated sensor device, the method comprising:

forming at least a portion of a micro-electro-mechanical systems (MEMS) sensor in a first substrate;

forming at least one additional sensor; and

bonding the first substrate to the second substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate, and the MEMS sensor communicates with the cavity.

10. The method of claim 9, further comprising packaging the first substrate and the second substrate.

11. The method of claim 9, wherein forming at least one additional sensor further comprises forming the at least one additional sensor in the first substrate, the second substrate, or combinations thereof.

12. The method of claim 9, wherein the MEMS sensor comprises an accelerometer, a gyroscope, or combinations thereof.

13. The method of claim 9, wherein the at least one additional sensor comprises a magnetic sensor.

14. The method of claim 9, wherein the cavity contains a vacuum or an inert gas.

15. A navigation device, comprising:

an integrated sensor device, comprising;

a first substrate including a surface portion;

a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate;

one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the one or more MEMS sensors communicates with the cavity; and

one or more additional sensors;

a processor operatively coupled to the integrated sensor device; and

a navigation module run by the processor, wherein the navigation module is configured to determine orientation information based on data from the integrated sensor device.

16. The navigation device of claim 15, further comprising a display configured to present the positional information to a user.

17. The navigation device of claim 15, wherein the navigation device comprises a personal navigation device (PND) or a smart phone.

18. The navigation device of claim 15, wherein the one or more MEMS sensors comprise an accelerometer, a gyroscope, a flow sensor, a gas detector, or combinations thereof.

19. The navigation device of claim 15, wherein the one or more additional sensors comprise a magnetic sensor, a pressure sensor, or combinations thereof.

20. The navigation device of claim 15, wherein the one or more additional sensors are formed in the first substrate, the second substrate, or combinations thereof.