MEMS DEVICE AND METHOD OF FABRICATING THE MEMS DEVICE

• US 20100313660A1
• Filed: 06/11/2010
• Published: 12/16/2010
• Est. Priority Date: 06/15/2009
• Status: Abandoned Application

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Nishikage, Haruhiko, Fujita, Toma, Kawauchi, Hironobu
• Application Number:
  US12/813,812
• Publication Number:
  US 20100313660A1
• Time in Patent Office: Days
• US Class Current: 73/514.32
• CPC Class Codes: B81B 2203/0136 Comb structures
• CPC Class Codes: B81B 2203/058 Rotation out of a plane parallel to the substrate
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration

Abstract

A MEMS device capable of detecting external force with high sensitivity is disclosed. The MEMS device includes: first and second support portions arranged on a substrate; a first movable portion that has a first movable electrode, is fixed to the first support portion at a position apart from the first movable electrode, and is displaced by the external force; and a second movable portion that has a second movable electrode arranged opposite to the first movable electrode, is fixed to the second support portion at a position apart from the second movable electrode, and is displaced by the external force, wherein the first movable portion is fixed to the first support portion between a gravitational center position of the first movable portion and an opposite position where the first movable electrode and the second movable electrode are opposed to each other, and the second movable portion is fixed to the second support portion at a position opposed to the opposite position while sandwiching a gravitational center position of the second movable portion therebetween.

Claims

1. A MEMS device comprising:

a substrate;

a first support portion and a second support portion, the first and second support portions being arranged on the substrate;

a first movable portion that has a first movable electrode, is fixed to the first support portion at a position apart from the first movable electrode, and is displaced by external force; and

a second movable portion that has a second movable electrode arranged opposite to the first movable electrode, is fixed to the second support portion at a position apart from the second movable electrode, and is displaced by the external force,

wherein the first movable portion is fixed to the first support portion between a gravitational center position of the first movable portion and an opposite position where the first movable electrode and the second movable electrode are opposed to each other, and the second movable portion is fixed to the second support portion at a position opposed to the opposite position while sandwiching a gravitational center position of the second movable portion therebetween.

2. The MEMS device according to claim 1,

wherein shapes of mutually opposed portions of the first movable portion and the second movable portion are individually comb-tooth shapes, and the first movable electrode and the second movable electrode are arranged in an interdigital fashion.

3. The MEMS device according to claim 1,

wherein the substrate includes an SOI substrate.

4. The MEMS device according to claim 1,

wherein the substrate includes a single crystal substrate.

5. The MEMS device according to claim 1,

wherein the second movable portion is arranged so as to surround a periphery of the first movable portion.

6. The MEMS device according to claim 5,

wherein a plurality of the opposite positions are provided.

7. The MEMS device according to claim 1,

wherein, at the opposite position, an upper surface of the first movable electrode and an upper surface of the second movable electrode are not flush with each other.

8. The MEMS device according to claim 1,

wherein the first movable electrode and the second movable electrode include cap layers on upper surfaces or lower surfaces thereof.

9. The MEMS device according to claim 7,

wherein, at the opposite position, a cap layer different in coefficient of linear expansion from the first movable portion and the second movable portion is arranged on at least either one of the first movable portion and the second movable portion.

10. The MEMS device according to claim 7,

wherein, at the opposite position, a film thickness of the first movable portion and a film thickness of the second movable portion are different from each other.

11. The MEMS device according to claim 1,

wherein each of the first movable portion and the second movable portion includes at least one slit that penetrates each of the first movable portion and the second movable portion from an upper surface thereof to a lower surface thereof.

12. The MEMS device according to claim 1,

wherein at least either one of the first movable electrode and the second movable electrode is displaced upward or downward.

13. The MEMS device according to claim 1,

wherein, in the first movable portion, the gravitational center position, the support position and the opposite position are arranged on a same axis in this order.

14. The MEMS device according to claim 1,

wherein, in the first movable portion, the gravitational center position, the support position and the opposite position are arranged on a same axis in this order, and in the second movable portion, the opposite position, the gravitational center position and the support position are arranged on a same axis in this order.

15. The MEMS device according to claim 5,

wherein, in the first movable position and the second movable position, the gravitational center positions, the support positions and the opposite position are arranged on a same axis in this order.

16. The MEMS device according to claim 6,

wherein the plurality of opposite positions exist on an extension on a same axis.

17. The MEMS device according to claim 4,

wherein the first movable electrode and the second movable electrode include an upper insulating film on upper surfaces thereof, and include sidewall insulating films on sidewall portions thereof.

18. The MEMS device according to claim 3,

wherein the first support portion and the second support portion are formed of a part of an insulating layer that composes the SOI substrate.

19. The MEMS device according to claim 4,

wherein the first support portion and the second support portion are formed of a part of the substrate.

20. The MEMS device according to claim 1,

wherein, in a case where the external force is applied to the MEMS device, electrostatic capacitance of one of the first movable electrode and the second movable electrode is increased, electrostatic capacitance of other of the first movable electrode and the second movable electrode is decreased, and a difference in electrostatic capacitance between the first movable electrode and the second movable electrode is outputted as a signal.

21. A method of fabricating a MEMS device including a first movable portion and a second movable portion opposed to the first movable portion, the method comprising the steps of:

forming an upper insulating film on an upper surface of a substrate made of single crystal;

patterning the upper insulating film, and forming trenches;

filling an insulating film into the trenches, and forming insulating isolation regions;

patterning the upper insulating film, and forming a metal electrode layer on an entire device surface;

patterning the metal electrode layer, and forming a first movable portion-purpose wring electrode connected to the first movable portion and a second movable portion-purpose wiring electrode connected to the second movable portion;

etching the substrate to a predetermined depth by selective etching using the upper insulating film as a mask;

depositing an insulating film on the entire device surface, and forming sidewall insulating films on sidewall portions of etched grooves;

removing by etching the insulating films deposited on the device surface and bottom surfaces of the etched grooves, and exposing respective surfaces of the first movable portion-purpose wiring electrode and the second movable portion-purpose wiring electrode; and

by isotropic etching for the substrate, forming spaces, and forming the first movable portion and the second movable portion, the first and second movable portion being obtained by patterning the substrate.

22. The method according to claim 21,

wherein the step of forming the first movable portion and the second movable portion includes the step of leaving a part of the substrate as a first support portion and a second support portion by adjusting a width of a plurality of slits, an interval pitch of the slits and a time of the isotropic etching, the slits being provided in the first movable portion and the second movable portion.

23. The method according to claim 21,

wherein, on sidewall portions of the first movable electrode and the second movable electrode, the sidewall insulating films are formed to approximately a same depth as a depth of the insulating isolation regions, and surfaces of the first movable electrode and the second movable electrode, the surfaces being opposed to the substrate, are etched back by the isotropic etching for forming the spaces.