HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS
First Claim
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1. An electrical circuit apparatus comprising:
- a first portion comprising;
a planar connection surface,a substrate provided from a wafer, wherein the substrate comprises a substrate surface opposite the planar connection surface, andat least one side surface extending between the substrate surface and the planar connection surface;
a second portion comprising;
a planar connection surface,a substrate provided from a wafer, wherein the substrate comprises a substrate surface opposite the planar connection surface, andat least one side surface extending between the substrate surface and the planar connection surface, wherein the planar connection surface of the first portion is bonded to the planar connection surface of the second portion to foam an interface defining at least one interface edge about the perimeter of the interface between the planar connection surfaces of the first portion and the second portion;
at least one circuit device comprising electrical circuitry, wherein the at least one circuit device is encompassed by at least portions of the first portion and the second portion; and
one or more seal portions covering at least the at least one interface edge of the interface to restrict moisture from ingressing into the apparatus.
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Abstract
Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.
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Citations
28 Claims
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1. An electrical circuit apparatus comprising:
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a first portion comprising; a planar connection surface, a substrate provided from a wafer, wherein the substrate comprises a substrate surface opposite the planar connection surface, and at least one side surface extending between the substrate surface and the planar connection surface; a second portion comprising; a planar connection surface, a substrate provided from a wafer, wherein the substrate comprises a substrate surface opposite the planar connection surface, and at least one side surface extending between the substrate surface and the planar connection surface, wherein the planar connection surface of the first portion is bonded to the planar connection surface of the second portion to foam an interface defining at least one interface edge about the perimeter of the interface between the planar connection surfaces of the first portion and the second portion; at least one circuit device comprising electrical circuitry, wherein the at least one circuit device is encompassed by at least portions of the first portion and the second portion; and one or more seal portions covering at least the at least one interface edge of the interface to restrict moisture from ingressing into the apparatus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of providing at least one electrical circuit apparatus, wherein the method comprises:
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providing a first portion, wherein the first portion comprises; a planar connection surface, a substrate provided from a wafer, wherein the substrate comprises a substrate surface opposite the planar connection surface, and at least one side surface extending between the substrate surface and the planar connection surface, providing a second portion, wherein the second portion comprises; a planar connection surface, a substrate provided from a wafer, wherein the substrate comprises a substrate surface opposite the planar connection surface, and at least one side surface extending between the substrate surface and the planar connection surface, providing at least one circuit device comprising electrical circuitry; coupling the planar connection surface of the first portion to the planar connection surface of the second portion to form an interface defining at least one interface edge about the perimeter of the interface between the planar connection surfaces of the first portion and the second portion, wherein the at least one circuit device is encompassed by at least portions of the first portion and the second portion; and providing one or more seal portions covering at least the at least one interface edge of the interface to restrict moisture from ingressing into the apparatus. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification