Ultrasonic probe
First Claim
1. A method of manufacturing a crystal resonator in which:
- on both principle surfaces of an AT-cut crystal wafer, there is formed a mask that corresponds to a large number of rectangular crystal elements and to frame sections that are respectively joined with said crystal elements by supporting sections and respectively surround said crystal elements, and etching is conducted, to thereby form a crystal wafer in which a large number of the crystal elements are joined with the frame sections by the supporting sections; and
then said crystal elements are mechanically cut away from the frame sections, wherein;
said mask, together with said crystal element and the frame section including the supporting section, has a projecting section, which extends in a +X-axis direction, on both end sections on a +X-axis one end of said crystal element;
a crystal wafer, in which the large number of crystal elements joined with the frame sections by the supporting sections, is obtained by said means of etching;
the projecting sections of the crystal element corresponding to said mask are distanced from said frame section at least after the etching has been conducted; and
the etching is conducted while forming triangular inclined surfaces with the apexes on the tip end of each corner section of mutually opposite surfaces, between both sides of the one end section.
1 Assignment
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Accused Products
Abstract
There is provided a crystal resonator (crystal element) in which the probability of chipping occurring in separation is small when there is one supporting section with respect to a frame section of a crystal wafer, and inclined surfaces due to the anisotropy of etching are eliminated. The present invention relates to a crystal resonator manufacturing method such that an AT-cut crystal wafer is etched, a large number of rectangular crystal elements are joined with frame sections by supporting sections, and the crystal elements are mechanically cut away from the frame sections. On both sides of the +X-axis one end section of the crystal element, at least the outer side surface has a planarly tapered projection having a triangular inclined surface with an apex in the −X-axis direction, and the tip end of the projection has processing traces of the etching in the +X-axis direction.
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Citations
6 Claims
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1. A method of manufacturing a crystal resonator in which:
- on both principle surfaces of an AT-cut crystal wafer, there is formed a mask that corresponds to a large number of rectangular crystal elements and to frame sections that are respectively joined with said crystal elements by supporting sections and respectively surround said crystal elements, and etching is conducted, to thereby form a crystal wafer in which a large number of the crystal elements are joined with the frame sections by the supporting sections; and
then said crystal elements are mechanically cut away from the frame sections, wherein;
said mask, together with said crystal element and the frame section including the supporting section, has a projecting section, which extends in a +X-axis direction, on both end sections on a +X-axis one end of said crystal element;
a crystal wafer, in which the large number of crystal elements joined with the frame sections by the supporting sections, is obtained by said means of etching;
the projecting sections of the crystal element corresponding to said mask are distanced from said frame section at least after the etching has been conducted; and
the etching is conducted while forming triangular inclined surfaces with the apexes on the tip end of each corner section of mutually opposite surfaces, between both sides of the one end section. - View Dependent Claims (2, 3, 4, 5, 6)
- on both principle surfaces of an AT-cut crystal wafer, there is formed a mask that corresponds to a large number of rectangular crystal elements and to frame sections that are respectively joined with said crystal elements by supporting sections and respectively surround said crystal elements, and etching is conducted, to thereby form a crystal wafer in which a large number of the crystal elements are joined with the frame sections by the supporting sections; and
Specification