WIRELESS IC DEVICE
First Claim
1. A wireless IC device comprising:
- a wireless IC device;
a feed circuit substrate that is coupled to the wireless IC and includes a feed circuit including a resonant circuit and/or a matching circuit, the resonant circuit and/or the matching circuit including at least one inductance element;
first and second radiation plates arranged to radiate a transmission signal provided from the feed circuit and/or provide a received signal to the feed circuit; and
a protective layer or a metal case covering the wireless IC device and provided on one main surface of the feed circuit substrate;
whereinthe first radiation plate is an electrode disposed on the protective layer or the metal case, and the second radiation plate is disposed on another main surface of the feed circuit substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protective layer, a first radiation plate, and a second radiation plate. The feed circuit substrate includes a feed circuit including inductance elements. The feed circuit is electrically connected to the wireless IC chip and coupled to the radiation plates. Signals received by the radiation plates are provided to the wireless IC chip via the feed circuit. Signals from the wireless IC chip are provided to the radiation plates via the feed circuit and then radiated to the outside.
-
Citations
8 Claims
-
1. A wireless IC device comprising:
-
a wireless IC device; a feed circuit substrate that is coupled to the wireless IC and includes a feed circuit including a resonant circuit and/or a matching circuit, the resonant circuit and/or the matching circuit including at least one inductance element; first and second radiation plates arranged to radiate a transmission signal provided from the feed circuit and/or provide a received signal to the feed circuit; and a protective layer or a metal case covering the wireless IC device and provided on one main surface of the feed circuit substrate;
whereinthe first radiation plate is an electrode disposed on the protective layer or the metal case, and the second radiation plate is disposed on another main surface of the feed circuit substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification