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MICROSTRUCTURED PATTERN INSPECTION METHOD

  • US 20100314541A1
  • Filed: 08/02/2010
  • Published: 12/16/2010
  • Est. Priority Date: 10/07/1999
  • Status: Active Grant
First Claim
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1. A computer-readable medium making computer display measurement results of a semiconductor wafer, based on electrons detected by a scanning electron microscope, the computer implementing steps, the steps comprising:

  • obtaining information relating to a measurement value between an upper part of a layer which forms a part of the semiconductor wafer and a lower part of the layer; and

    displaying the information for each prescribed area on the semiconductor wafer.

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