Lighting Device

• US 20100314641A1
• Filed: 10/25/2006
• Published: 12/16/2010
• Est. Priority Date: 10/25/2006
• Status: Abandoned Application

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Schmidt, Hans-Joachim
• Application Number:
  US12/446,181
• Publication Number:
  US 20100314641A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 7/24 characterised by the material
• CPC Class Codes: F21V 7/28 characterised by coatings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A lighting device can include at least one optoelectronic semiconductor chip, which emits electromagnetic radiation and generates heat in operation, and a reflector. The reflector is suitable for deflecting the electromagnetic radiation and dissipating the heat generated by the optoelectronic semiconductor chip by means of a reflecting surface.

Claims

1. A lighting device, comprising:

an optoelectronic semiconductor chip, which emits electromagnetic radiation and generates heat in operation, and

a reflector, wherein the reflector deflects electromagnetic radiation by means of a reflecting surface, and the reflector dissipates the heat generated by the optoelectronic semiconductor chip.

2. The lighting device according to claim 1, wherein the heat dissipated by the optoelectronic semiconductor chip can be emitted to the environment by the reflector over a surface of the reflector.

3. The lighting device according to claim 1, wherein the heat generated by the optoelectronic semiconductor chip is emitted to the environment substantially exclusively by means of the reflector.

4. The lighting device according to claim 1, wherein the reflector comprises a receiving region, in which the optoelectronic semiconductor chip is mounted.

5. The lighting device according to claim 4, wherein the receiving region of the reflector is thermally coupled to the optoelectronic semiconductor chip.

6. The lighting device according to claim 4, further comprising a spacing element is arranged between the receiving region and the optoelectronic semiconductor chip.

7. The lighting device according to claim 6, wherein the spacing element comprises a thermally conducting material.

8. The lighting device according to claim 1, further comprising a carrier body, on which the reflector is mounted.

9. The lighting device according to claim 8, wherein

the reflector has openings, and

the optoelectronic semiconductor chip is mounted on the carrier body through the openings.

10. The lighting device according to claim 1, wherein the reflector has an aperture, an electrical contact for the optoelectronic semiconductor chip passing through the aperture.

11. The lighting device according to claim 1, wherein the optoelectronic semiconductor chip is mounted on the reflector by means of a plug-in connection, screw connection or clamp connection.

12. The lighting device according to claim 1, wherein the optoelectronic semiconductor chip has a rotationally symmetric side-emitting emission characteristic.

13. The lighting device according to claim 12, wherein the optoelectronic semiconductor chip emits at least 85% of the electromagnetic radiation into a solid angular emission region arranged to a side of the optoelectronic semiconductor chip with a first emission angle and a second emission angle.

14. The lighting device according to claim 13, wherein the reflecting surface of the reflector covers the solid angular emission region.

15. The lighting device according to claim 13, wherein the reflecting surface of the reflector is bounded by a first boundary line and a second boundary line, and the first and the second boundary lines cover the first and the second emission angles respectively.

16. The lighting device according to claim 1, wherein the reflector is implemented in the form of a collimator.

17. The lighting device according to claim 16, wherein the reflecting surface is shaped at least partially in the form of an elliptical paraboloid or a rotational paraboloid.

18. The lighting device according to claim 17, wherein the reflecting surface has a focal point, the optoelectronic semiconductor chip has an emission focal point, and the emission focal point is arranged at the focal point of the reflecting surface.

19. The lighting device according to claim 1, wherein the reflector comprises a thermally conductive material.

20. The lighting device according to claim 1, wherein the reflector comprises a reflecting material.

21. The lighting device according to claim 1, wherein the reflector comprises aluminum.

22. The lighting device according to claim 21, wherein the reflecting surface comprises anodized aluminum or silver.

23. The lighting device according to claim 1, wherein the reflecting surface has a reflectivity greater than or equal to 85% for the electromagnetic radiation generated by the optoelectronic semiconductor chip.

24. The lighting device according to claim 1, wherein the optoelectronic semiconductor chip is connected to the reflector by a detachable connection.