LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20100314654A1
• Filed: 12/26/2007
• Published: 12/16/2010
• Est. Priority Date: 12/28/2006
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Hayashi, Masaki
• Granted Patent: US 8,093,619 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device, which can be efficiently manufactured and maintain a stable light emitting property for a long period, is provided. The light emitting device comprises a first resin forming body including a periphery that forms a recess to house a light emitting element and a bottom that forms a bottom portion of the recess, and a second resin forming body which covers the light emitting element. The first resin forming body is composed of a thermosetting epoxy resin composite whose essential component is an epoxy resin. The bottom covers surfaces of lead frames excluding mounting regions of the light emitting element and wires. A thickness of the bottom is formed thinner than a thickness from the surface of the lead frames to a leading end of the light emitting element.

Claims

1. A light emitting device comprising:

a light emitting element;

first and second lead frames electrically connected to the light emitting element;

a first resin forming body including a periphery which forms a recess for housing the light emitting element on the first and the second lead frames, and a bottom which forms a bottom portion of the recess; and

a second resin forming body which covers the light emitting element housed in the recess of the first resin forming body, wherein

the first resin forming body is composed of a thermosetting epoxy resin composite of which essential component is an epoxy resin,

the bottom covers surfaces of the first and the second lead frames excluding a mounting region of the light emitting element and mounting regions of wires, and

a thickness of the bottom is thinner than a thickness from a surface of the first and the second lead frames to a leading end of the light emitting element.

2. The light emitting device according to claim 1, wherein

the first resin forming body is composed of a thermosetting epoxy resin composite of which essential component is an epoxy resin including a triazine derivative epoxy resin, and

the second resin forming body is composed of the same material as the first resin forming body, or a silicon included resin.

3. The light emitting device according to claim 1, wherein

the first resin forming body includes a peripheral side surface surrounding a circumference of the light emitting element at the bottom, and

the peripheral side surface has a predetermined inclination so that a circumference of an upper surface of the bottom is longer than a circumference of a bottom surface of the bottom.

4. The light emitting device according to claim 2, wherein

the first resin forming body includes a peripheral side surface surrounding a circumference of the light emitting element at the bottom, and

the peripheral side surface has a predetermined inclination so that a circumference of an upper surface of the bottom is longer than a circumference of a bottom surface of the bottom.

5. The light emitting device according to claim 1, wherein the bottom and the periphery of the first resin forming body are integratedly formed, or the bottom and the periphery of the first resin forming body are separately formed.

6. The light emitting device according to claim 2, wherein the bottom and the periphery of the first resin forming body are integratedly formed, or the bottom and the periphery of the first resin forming body are separately formed.

7. The light emitting device according to claim 1, wherein an anchor hole or a groove is provided with the first and the second lead frames, and the first resin forming body is filled in the anchor hole or the groove.

8. The light emitting device according to claim 2, wherein an anchor hole or a groove is provided with the first and the second lead frames, and the first resin forming body is filled in the anchor hole or the groove.

9. A method for manufacturing a light emitting device, which includes a light emitting element, first and second lead frames electrically connected to the light emitting element, a first resin forming body including a periphery which forms a recess for housing the light emitting element on the first and the second lead frames and a bottom which forms a bottom portion of the recess, and a second resin forming body which covers the light emitting element housed in the recess of the first resin forming body, and in which a thickness of the bottom is thinner than a thickness from a surface of the first and the second lead frames to a leading end of the light emitting element, comprising:

a first step in which the first lead frame and the second lead frame are pinched by an upper mold on which the same shaped spaces as the periphery and the bottom of the first resin forming body are beforehand formed, and a lower mold which corresponds to the upper mold, with having a space between the first and the second lead frames,

a second step in which a first thermosetting resin is injected into a space pinched by the upper mold and the lower mold to fill the space formed on the upper mold,

a third step in which the first resin forming body is integratedly formed with the first and the second lead frames by the first thermosetting resin which is filled in the space formed on the upper mold,

a fourth step in which the light emitting element is housed in the recess of the first resin forming body, the recess being formed corresponding to the space formed on the upper mold, and is electrically connected to the first and the second lead frames, and

a fifth step in which a second thermosetting resin is injected into the recess of the first resin forming body to cover the light emitting element housed in the recess, and the second resin forming body is formed.