ELECTROCHEMICAL SENSOR DEVICE, METHOD OF MANUFACTURING THE SAME

• US 20100314699A1
• Filed: 12/07/2007
• Published: 12/16/2010
• Est. Priority Date: 12/12/2006
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Meftah, Mohammed, Widdershoven, Franciscus Petrus
• Application Number:
  US12/517,858
• Publication Number:
  US 20100314699A1
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: G01N 27/414 Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
• CPC Class Codes: G01N 33/5438 Electrodes
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

An electrochemical sensor device (100) for analysing a sample, the device (100) comprising an electronic chip (101) comprising a sensor portion (102) being sensitive for particles of the sample, a carrier element (103, 104) bonded to the electronic chip (101) to define a fluidic path together with the electronic chip (101), and a counter electrode (105) provided in a surface portion of the carrier element (103, 104).

Claims

1. An electrochemical sensor device (100) for analysing a sample, the device (100) comprising

an electronic chip (101) comprising a sensor portion (102) being sensitive for particles of the sample;

a carrier element (103, 104) bonded to the electronic chip (101) to define a fluidic path together with the electronic chip (101);

a counter electrode (105) provided in a surface portion of the carrier element (103, 104).

2. The device (100) of claim 1,

wherein the carrier element (103, 104) comprises a well member (103), particularly a Molded Interconnection Device, comprising a well (106), wherein the sensor portion (102) is located adjacent to a bottom portion of the well member (103).

3. The device (100) of claim 2,

wherein the carrier element (103, 104) comprises a cover member (104), particularly a fluidic package part, arranged relative to the well member (103) to define an inlet (107) and an outlet (108) of the fluidic path between the cover member (104) and the well member (103).

4. The device (400) of claim 2,

comprising a sample flow barrier (401) between the well member (103) and the electronic chip (101).

5. The device (100) of claim 2,

wherein the well member (103) is bonded to the electronic chip (101).

6. The device (100) of claim 1,

wherein the carrier element (103, 104) is bonded to the electronic chip (101) via a metal bump (109), particularly for electrically coupling an electric circuit in the electronic chip (101) with an electric circuit conductively coupled to the carrier element (103, 104).

7. The device (400) of claim 1,

comprising an electrically conductive track (402) provided on a lower surface of the well member (103).

8. The device (100) of claim 2,

wherein the counter electrode (105) is accommodated in the well (106).

9. The device (400) of claim 2,

wherein the well member (103) comprises a bridge element (403) adjacent to the cover member (104) and extending in the well (106) towards the electronic chip (101), wherein the counter electrode (105) is formed at an end portion of the bridge element (403) to define the fluidic path between the counter electrode (105) and the sensor portion (102) of the electronic chip (101) opposing the counter electrode (105).

10. The device (800) of claim 3,

wherein the counter electrode (105) is accommodated in at least one of the group consisting of the inlet (107) and the outlet (108) of the fluidic path.

11. The device (800) of claim 3,

wherein the counter electrode (105) is connected to at least one of the group consisting of an upper surface of the well member (103) and a lower surface of the cover element (104) in at least one of the group consisting of the inlet (107) and the outlet (108) of the fluidic path.

12. The device (100) of claim 1,

wherein the counter electrode (105) is arranged off-chip.

13. The device (1200) of claim 1,

wherein the sensor portion (102) is a capacitive sensor portion, particularly comprises electric circuitry (1201) integrated in the electronic chip (101), a working electrode (1202) provided on the electric circuitry (1201), and a self-assembled monolayer (1203) provided on the working electrode (1202).

14. The device (100) of claim 1,

adapted as at least one of the group consisting of a sensor device, a biosensor device, a biochip, a lab-on-chip, an electrophoresis device, a sample transport device, a sample mix device, a cell lysing device, a sample washing device, a sample purification device, a polymerase chain reaction device, and a hybridization analysis device.

15. A sensor array for analysing a sample,

the sensor array comprising a plurality of electrochemical sensor devices (100) according to claim 1.

16. A method of manufacturing an electrochemical sensor device (100) for analysing a sample, the method comprising

providing an electronic chip (101) comprising a sensor portion (102) being sensitive for particles of the sample;

providing a carrier element (103, 104) bonded to the electronic chip (101) to define a fluidic path together with the electronic chip (101);

providing a counter electrode (105) in a surface portion of the carrier element (103, 104).