Imaging Device and Manufacturing method therefor

• US 20100315546A1
• Filed: 01/15/2008
• Published: 12/16/2010
• Est. Priority Date: 02/21/2007
• Status: Abandoned Application

• Current Assignee: Konica Minolta OPTO Incorporated (Konica Minolta Inc.)
• Original Assignee: Konica Minolta OPTO Incorporated (Konica Minolta Inc.)
• Inventors: Saito, Masashi
• Application Number:
  US12/526,259
• Publication Number:
  US 20100315546A1
• Time in Patent Office: Days
• US Class Current: 348/374
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49817 with other than ancillary treating or assembling

Abstract

There is provided an imaging device capable of easily shielding an imaging element. The imaging device comprises a conductive mirror frame, an element unit including an imaging element equipped with a photoelectric converter, and an imaging lens attached within the mirror frame and imaging a subject image on the photoelectric converter of the imaging element. The element unit has an exposed conductive member contactable to the mirror frame.

Claims

1. An imaging device comprising:

a conductive lens barrel;

an element unit including an imaging element equipped with a photoelectric converter;

and

an imaging lens that is provided in the lens barrel, and forms an image of a photographic object on the photoelectric converter of the imaging element,

wherein a conductive member capable of being in contact with the lens barrel is exposed at the surface of the element unit.

2. The imaging device of claim 1, wherein the element unit comprises a resin plate into which the conductive member is inserted and is provided on a reverse side of the imaging element, wherein the conductive member appears when the resin plate is cut.

3. The imaging device of claim 1,

wherein the conductive member is connected to a ground terminal of the imaging device.

4. An imaging device comprising:

an element unit including an imaging element equipped with a photoelectric converter and a resin plate provided on a reverse side of the imaging element; and

an imaging lens that forms an image of a photographic object on the photoelectric converter of the imaging element,

wherein a conductive member that comes in contact with a terminal of the imaging element when provided on the imaging element, is inserted in the resin plate.

5. A manufacturing method for an imaging device provided with an imaging element having a photoelectric converter and an imaging lens that forms an image of a photographic object on the photoelectric converter of the imaging element, the method comprising:

forming an imaging lens array equipped with a plurality of imaging lenses;

selecting a prescribed imaging lens in the imaging lens array;

forming an apparatus assembly by gluing the imaging element only to the prescribed imaging lens; and

forming an imaging device by cutting and separating the apparatus assembly.